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Chikai Tanaka

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  • Ayase-Shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer table for local dry etching apparatus
    • Patent number 7,005,032
    • Issue date Feb 28, 2006
    • Speedfam Co., Ltd
    • Michihiko Yanagisawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer etching method
    • Patent number 6,451,217
    • Issue date Sep 17, 2002
    • SpeedFam-IPEC Co., Ltd.
    • Michihiko Yanagisawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer flattening system
    • Patent number 6,360,687
    • Issue date Mar 26, 2002
    • SpeedFam-IPEC Co., Ltd.
    • Michihiko Yanagisawa
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Local etching apparatus
    • Patent number 6,302,995
    • Issue date Oct 16, 2001
    • SpeedFam-IPEC Co., Ltd.
    • Chikai Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Combined CMP and plasma etching wafer flattening system
    • Patent number 6,254,718
    • Issue date Jul 3, 2001
    • SpeedFam Co., Ltd.
    • Chikai Tanaka
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents