Chikara Aikawa

Person

Ota-Ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser processing apparatus
- Patent number 10,276,413
- Issue date Apr 30, 2019
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,054,179
- Issue date Jun 9, 2015
- Disco Corporation
- Chikara Aikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing apparatus and laser processing apparatus
- Patent number 8,642,920
- Issue date Feb 4, 2014
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER OPTICAL SYSTEM AND ADJUSTMENT METHOD THEREFOR, AND LASER MACH...
- Publication number 20250018504
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Chikara AIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR ADJUSTING OPTICAL AXIS OF LASER LIGHT
- Publication number 20250018501
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Chikara AIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER LIGHT CORRECTION METHOD
- Publication number 20250018502
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Chikara AIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING APPARATUS AND LASER MACHINING METHOD
- Publication number 20230264292
- Publication date Aug 24, 2023
- TOKYO SEIMITSU CO., LTD.
- Chikara AIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CON...
- Publication number 20230150054
- Publication date May 18, 2023
- TOKYO SEIMITSU CO., LTD.
- Chikara AIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20150283650
- Publication date Oct 8, 2015
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20150214432
- Publication date Jul 30, 2015
- Disco Corporation
- Naotoshi Kirihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20150104930
- Publication date Apr 16, 2015
- Disco Corporation
- Chikara Aikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE WAFER PROCESSING METHOD
- Publication number 20130122619
- Publication date May 16, 2013
- Disco Corporation
- Chikara AIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS
- Publication number 20110147349
- Publication date Jun 23, 2011
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20100044590
- Publication date Feb 25, 2010
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Chikara Aikawa

Person

Patents Grantslast 30 patents

Laser processing apparatus

Wafer processing method

Wafer dividing apparatus and laser processing apparatus

Patents Applicationslast 30 patents

LASER OPTICAL SYSTEM AND ADJUSTMENT METHOD THEREFOR, AND LASER MACH...

METHOD AND DEVICE FOR ADJUSTING OPTICAL AXIS OF LASER LIGHT

LASER LIGHT CORRECTION METHOD

LASER MACHINING APPARATUS AND LASER MACHINING METHOD

LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CON...

LASER PROCESSING APPARATUS

OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR

WAFER PROCESSING METHOD

OPTICAL DEVICE WAFER PROCESSING METHOD

WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS

LASER PROCESSING METHOD