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Chikara Aikawa

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  • Ota-Ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,276,413
    • Issue date Apr 30, 2019
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,054,179
    • Issue date Jun 9, 2015
    • Disco Corporation
    • Chikara Aikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer dividing apparatus and laser processing apparatus
    • Patent number 8,642,920
    • Issue date Feb 4, 2014
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER MACHINING DEVICE, WAFER PROCESSING SYSTEM, AND METHOD FOR CON...
    • Publication number 20230150054
    • Publication date May 18, 2023
    • TOKYO SEIMITSU CO., LTD.
    • Chikara AIKAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20150283650
    • Publication date Oct 8, 2015
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20150214432
    • Publication date Jul 30, 2015
    • Disco Corporation
    • Naotoshi Kirihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150104930
    • Publication date Apr 16, 2015
    • Disco Corporation
    • Chikara Aikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20130122619
    • Publication date May 16, 2013
    • Disco Corporation
    • Chikara AIKAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS
    • Publication number 20110147349
    • Publication date Jun 23, 2011
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20100044590
    • Publication date Feb 25, 2010
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR