Chiko YORITA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an interlayer connection substrate
- Patent number 9,320,154
- Issue date Apr 19, 2016
- Hitachi, Ltd.
- Akira Soeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded electronic components and method of manufacturing the same
- Patent number 9,001,528
- Issue date Apr 7, 2015
- Renesas Electronics Corporation
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,763,242
- Issue date Jul 1, 2014
- Renesas Electronics Corporation
- Kenya Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,742,499
- Issue date Jun 3, 2014
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,633,103
- Issue date Jan 21, 2014
- Renesas Electronics Corporation
- Hanae Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,656,030
- Issue date Feb 2, 2010
- Renesas Technology Corp.
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave filter and manufacturing method of the same
- Patent number 7,583,163
- Issue date Sep 1, 2009
- Renesas Technology Corp.
- Yasuo Osone
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 7,554,193
- Issue date Jun 30, 2009
- Renesas Technology Corp.
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20140353018
- Publication date Dec 4, 2014
- Hitachi, Ltd
- Akira SOEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonded Board and Manufacturing Method Thereof
- Publication number 20130133936
- Publication date May 30, 2013
- Hitachi, Ltd
- Chiko YORITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120292772
- Publication date Nov 22, 2012
- Renesas Electronics Corporation
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110248389
- Publication date Oct 13, 2011
- RENESAS ELECTRONICS CORPORATION
- Chiko YORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156225
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110128713
- Publication date Jun 2, 2011
- RENESAS ELECTRONICS CORPORATION
- Kenya KAWANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110012263
- Publication date Jan 20, 2011
- Renesas Electronics Corporation
- Hanae HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100230789
- Publication date Sep 16, 2010
- RENESAS TECHNOLOGY CORP.
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100172116
- Publication date Jul 8, 2010
- RENESAS TECHNOLOGY CORP.
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100109052
- Publication date May 6, 2010
- RENESAS TECHNOLOGY CORP.
- Shizuki NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Acoustic wave filter and manufacturing method of the same
- Publication number 20080129412
- Publication date Jun 5, 2008
- Renesas Technology Corp.
- Yasuo Osone
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor device
- Publication number 20070176298
- Publication date Aug 2, 2007
- Hitachi, Ltd
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070040255
- Publication date Feb 22, 2007
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS

Chiko YORITA

Person

Patents Grantslast 30 patents

Method of manufacturing an interlayer connection substrate

Shielded electronic components and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of the same

Semiconductor device

Acoustic wave filter and manufacturing method of the same

Semiconductor device

Patents Applicationslast 30 patents

INTERLAYER CONNECTION SUBSTRATE AND ITS MANUFACTURING METHOD

Bonded Board and Manufacturing Method Thereof

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Acoustic wave filter and manufacturing method of the same

Semiconductor device

Semiconductor device