Chilwoo KWON

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 11,728,283
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Chilwoo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure of semiconductor chip...
- Patent number 11,264,339
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,985,091
- Issue date Apr 20, 2021
- Samsung Electronics Co., Ltd.
- Daeyeun Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220045017
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Chilwoo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...
- Publication number 20200273817
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200194348
- Publication date Jun 18, 2020
- Samsung Electronics Co., Ltd.
- Daeyeun CHOI
- H01 - BASIC ELECTRIC ELEMENTS