Chin-Chen Wang

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a package
- Patent number 11,913,132
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Chun Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,344,383
- Issue date Jul 9, 2019
- Advanced Semiconductor Engineering, Inc.
- Chuan-Yung Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Linear motor and compressor having the same
- Patent number 10,107,275
- Issue date Oct 23, 2018
- Chin-Chao Wang
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Reciprocating electric motor
- Patent number 9,800,127
- Issue date Oct 24, 2017
- Chin-Chao Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Press plate of wire bond checking system
- Patent number 6,392,424
- Issue date May 21, 2002
- Advanced Semiconductor Engineering Inc.
- Chin-Chen Wang
- G01 - MEASURING TESTING
Information Patent Grant
Thermal board used for bonding wires in semiconductor manufacturing...
- Patent number 6,195,258
- Issue date Feb 27, 2001
- Advanced Semiconductor Engineering, Inc.
- Yu-Fang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base for wire bond checking
- Patent number 6,172,318
- Issue date Jan 9, 2001
- Advanced Semiconductor Engineering Inc.
- Chin-Chen Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A PACKAGE
- Publication number 20230374689
- Publication date Nov 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia Chun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER METHOD, MASS TRANSFER DEVICE AND BUFFER CARRIER
- Publication number 20210327731
- Publication date Oct 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Wen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190040527
- Publication date Feb 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Chuan-Yung SHIH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LINEAR MOTOR AND COMPRESSOR HAVING THE SAME
- Publication number 20160156235
- Publication date Jun 2, 2016
- Chin-Chao WANG
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Reciprocating Electric Motor
- Publication number 20160013711
- Publication date Jan 14, 2016
- Chin-Chao WANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LED package structure and method for manufacturing the same
- Publication number 20070215998
- Publication date Sep 20, 2007
- Chi Lin Technology Co., Ltd.
- Chen-Ze Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package and wire bonding process thereof
- Publication number 20060266804
- Publication date Nov 30, 2006
- Chin Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Chen Wang

Person

Patents Grantslast 30 patents

Method for manufacturing a package

Semiconductor package device and method of manufacturing the same

Linear motor and compressor having the same

Reciprocating electric motor

Press plate of wire bond checking system

Thermal board used for bonding wires in semiconductor manufacturing...

Base for wire bond checking

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A PACKAGE

MASS TRANSFER METHOD, MASS TRANSFER DEVICE AND BUFFER CARRIER

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

LINEAR MOTOR AND COMPRESSOR HAVING THE SAME

Reciprocating Electric Motor

LED package structure and method for manufacturing the same

Chip package and wire bonding process thereof