TREA

Chin Cheng Chien

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  • Shin-Shih Village, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Heat Dissipation Structures
    • Publication number 20240413052
    • Publication date Dec 12, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Hsiang HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-SILICON VIAS IN INTEGRATED CIRCUIT PACKAGING
    • Publication number 20240386183
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Fong-yuan CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES
    • Publication number 20240312978
    • Publication date Sep 19, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-Yuan CHANG
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    Photonic Semiconductor Device and Method
    • Publication number 20240142732
    • Publication date May 2, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Hsin Lu
    • G02 - OPTICS
  • Information Patent Application

    Layout Design Methodology For Stacked Devices
    • Publication number 20230361104
    • Publication date Nov 9, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-Yuan Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    HEAT DISSIPATION STRUCTURES
    • Publication number 20230352366
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hsiang HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-SILICON VIA IN INTEGRATED CIRCUIT PACKAGING
    • Publication number 20230205967
    • Publication date Jun 29, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-yuan CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SOIC CHIP ARCHITECTURE
    • Publication number 20220375827
    • Publication date Nov 24, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-Yuan Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERPOSER WITH CAPACITORS
    • Publication number 20220320018
    • Publication date Oct 6, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Fong-yuan CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20220246509
    • Publication date Aug 4, 2022
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHIN-HER CHIEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES
    • Publication number 20220130818
    • Publication date Apr 28, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-Yuan Chang
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    HEAT DISSIPATION STRUCTURES
    • Publication number 20210375717
    • Publication date Dec 2, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hsiang HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
    • Publication number 20210335668
    • Publication date Oct 28, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Bo-Jr Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Through-Silicon Vias in Integrated Circuit Packaging
    • Publication number 20210173998
    • Publication date Jun 10, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-yuan CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20200395281
    • Publication date Dec 17, 2020
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHIN-HER CHIEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
    • Publication number 20200321248
    • Publication date Oct 8, 2020
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Bo-Jr Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES
    • Publication number 20200168595
    • Publication date May 28, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-Yuan CHANG
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    SOIC CHIP ARCHITECTURE
    • Publication number 20200168527
    • Publication date May 28, 2020
    • Taiwan Semiconductor Manfacturing Co., Ltd.
    • Fong-Yuan CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERPOSER WITH CAPACITORS
    • Publication number 20200043873
    • Publication date Feb 6, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Fong-yuan CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    THROUGH SILICON VIA OPTIMIZATION FOR THREE-DIMENSIONAL INTEGRATED C...
    • Publication number 20200020635
    • Publication date Jan 16, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-Yuan CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THROUGH-SILICON VIAS IN INTEGRATED CIRCUIT PACKAGING
    • Publication number 20200019668
    • Publication date Jan 16, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Fong-yuan CHANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    HEAT DISSIPATION STRUCTURES
    • Publication number 20200006194
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Hsiang HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
    • Publication number 20190109046
    • Publication date Apr 11, 2019
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Bo-Jr Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
    • Publication number 20180012799
    • Publication date Jan 11, 2018
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Bo-Jr Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Manufacturing Method of Non-Planar FET
    • Publication number 20170098710
    • Publication date Apr 6, 2017
    • UNITED MICROELECTRONICS CORP.
    • Chin-Cheng Chien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY PANEL AND DISPLAY DEVICE
    • Publication number 20160260738
    • Publication date Sep 8, 2016
    • InnoLux Corporation
    • MENG-CHANG HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EPITAXIAL PROCESS APPLYING LIGHT ILLUMINATION
    • Publication number 20160211144
    • Publication date Jul 21, 2016
    • UNITED MICROELECTRONICS CORP.
    • Yu-Ying Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OXIDE DEFINITION (OD) GRADIENT REDUCED SEMICONDUCTOR DEVICE
    • Publication number 20160163687
    • Publication date Jun 9, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yi-Lin CHUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Repairing Monolithic Stacked Integrated Circuits with a Redundant L...
    • Publication number 20160163680
    • Publication date Jun 9, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuan-Yu Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLEANING PROCESS FOR OXIDE
    • Publication number 20160126091
    • Publication date May 5, 2016
    • UNITED MICROELECTRONICS CORP.
    • Ted Ming-Lang Guo
    • H01 - BASIC ELECTRIC ELEMENTS