Chin-Chi Shen

Follow

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bond pad structure
- Patent number 7,429,795
- Issue date Sep 30, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Tsai Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to produce dual polysilicon resistance in an integrated circuit
- Patent number 6,211,031
- Issue date Apr 3, 2001
- Taiwan Semiconductor Manufacturing Company
- Dah-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor chips separated by scribe lines...
- Patent number 5,622,899
- Issue date Apr 22, 1997
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chem Chao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Bond pad structure
- Publication number 20070090402
- Publication date Apr 26, 2007
- Wen-Tsai Su
- H01 - BASIC ELECTRIC ELEMENTS