Chin-Ching HUANG

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Zhudong Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,714,528
- Issue date Jul 14, 2020
- Xintec Inc.
- Hsin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,347,616
- Issue date Jul 9, 2019
- Xintec Inc.
- Hsin Kuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190140012
- Publication date May 9, 2019
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170330871
- Publication date Nov 16, 2017
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS