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Chin-Ching Huang
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Saratoga, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
System and method for reducing latency in software modem for high-s...
Patent number
6,233,250
Issue date
May 15, 2001
Integrated Telecom Express, Inc.
Young Way Liu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Printed circuit board layout to minimize the clock delay caused by...
Patent number
6,047,467
Issue date
Apr 11, 2000
VLSI Technology, Inc.
Ahmad B. Hamzehdoost
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board layout to minimize the clock delay caused by...
Patent number
5,742,009
Issue date
Apr 21, 1998
VLSI Technology Corporation
Ahmad Hamzehdoost
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layered, integrated circuit package having reduced parasitic...
Patent number
5,641,988
Issue date
Jun 24, 1997
VLSI Technology, Inc.
Chin-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layered, integrated circuit package having reduced parasitic...
Patent number
5,625,225
Issue date
Apr 29, 1997
VLSI Technology, Inc.
Chin-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method for reducing bond wire inductance
Patent number
5,371,321
Issue date
Dec 6, 1994
VLSI Technology, Inc.
Ahmad Hamzehdoost
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance package using high dielectric constant materials f...
Patent number
5,371,403
Issue date
Dec 6, 1994
VLSI Technology, Inc.
Chin-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for bonding a semiconductor die to a package using a gold...
Patent number
5,259,545
Issue date
Nov 9, 1993
VLSI Technology, Inc.
Chin-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of bonding a semiconductor die to a package using a gold/sil...
Patent number
5,188,982
Issue date
Feb 23, 1993
VLSI Technology, Inc.
Chin-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of providing power to an integrated circuit
Patent number
5,172,471
Issue date
Dec 22, 1992
VLSI Technology, Inc.
Chin C. Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead and socket structures with reduced self-inductance
Patent number
5,138,431
Issue date
Aug 11, 1992
VLSI Technology, Inc.
Chin-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
xDSL modem with asynchronous transfer mode (ATM) layer & latency re...
Publication number
20010005367
Publication date
Jun 28, 2001
Young Way Liu
H04 - ELECTRIC COMMUNICATION TECHNIQUE