Chin Fay Lai

Person

Wu Ryh, Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for laminating a film on a wafer
- Patent number 8,517,074
- Issue date Aug 27, 2013
- C Sun Mfg. Ltd.
- Chin-Sen Lai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Transporter for dry film laminator
- Patent number 8,291,957
- Issue date Oct 23, 2012
- C Sun Mfg. Ltd.
- Chin-Sen Lai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cutting mechanism for dry film laminator
- Patent number 8,069,893
- Issue date Dec 6, 2011
- Chin-Sen Lai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Protection mechanism for dry film laminator
- Patent number 8,042,590
- Issue date Oct 25, 2011
- C Sum Mfg. Ltd.
- Chin-Sen Lai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flattening mechanism for dry film laminator
- Patent number 8,016,012
- Issue date Sep 13, 2011
- Chin-Sen Lai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wire collecting mechanism for wire-cut electrical discharge machine
- Patent number 7,923,656
- Issue date Apr 12, 2011
- Max See Industry Co., Ltd.
- Chin-Hung Lai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip carrier, semiconductor package and fabricating method thereof
- Patent number 6,617,680
- Issue date Sep 9, 2003
- Siliconware Precision Industries Co., Ltd.
- Chen Chien-Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly efficient over current circuit breaker
- Patent number 4,933,799
- Issue date Jun 12, 1990
- Chin Fay Lai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR LAMINATING A FILM ON A WAFER
- Publication number 20120103531
- Publication date May 3, 2012
- Chin-Sen LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
CUTTING MECHANISM FOR DRY FILM LAMINATOR
- Publication number 20110186232
- Publication date Aug 4, 2011
- C SUN MFG. LTD.
- Chin-Sen LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
FLATTENING MECHANISM FOR DRY FILM LAMINATOR
- Publication number 20110186239
- Publication date Aug 4, 2011
- C SUN MFG. LTD.
- Chin-Sen LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
PROTECTION MECHANISM FOR DRY FILM LAMINATOR
- Publication number 20110186231
- Publication date Aug 4, 2011
- C SUN MFG. LTD.
- Chin-Sen LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR LAMINATING A FILM ON A WAFER
- Publication number 20110186215
- Publication date Aug 4, 2011
- C SUN MFG. LTD.
- Chin-Sen LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
TRANSPORTER FOR DRY FILM LAMINATOR
- Publication number 20110186234
- Publication date Aug 4, 2011
- C SUN MFG. LTD.
- Chin-Sen LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
FOLDABLE HAND TOOL
- Publication number 20090260234
- Publication date Oct 22, 2009
- Chin Tsai LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE COLLECTING MECHANISM FOR WIRE-CUT ELECTRICAL DISCHARGE MACHINE
- Publication number 20080179295
- Publication date Jul 31, 2008
- Max See Industry Co., Ltd.
- Chin-Hung LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip carrier, semiconductor package and fabricating method thereof
- Publication number 20040072389
- Publication date Apr 15, 2004
- Siliconware Precision Industries Co., Ltd.
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip carrier, semiconductor package and fabricating method thereof
- Publication number 20030038351
- Publication date Feb 27, 2003
- Siliconware Precision Industries, Co., Ltd.
- Chen Chien-Chih
- H01 - BASIC ELECTRIC ELEMENTS

Chin Fay Lai

Person

Patents Grantslast 30 patents

Apparatus for laminating a film on a wafer

Transporter for dry film laminator

Cutting mechanism for dry film laminator

Protection mechanism for dry film laminator

Flattening mechanism for dry film laminator

Wire collecting mechanism for wire-cut electrical discharge machine

Chip carrier, semiconductor package and fabricating method thereof

Highly efficient over current circuit breaker

Patents Applicationslast 30 patents

APPARATUS FOR LAMINATING A FILM ON A WAFER

CUTTING MECHANISM FOR DRY FILM LAMINATOR

FLATTENING MECHANISM FOR DRY FILM LAMINATOR

PROTECTION MECHANISM FOR DRY FILM LAMINATOR

APPARATUS AND METHOD FOR LAMINATING A FILM ON A WAFER

TRANSPORTER FOR DRY FILM LAMINATOR

FOLDABLE HAND TOOL

WIRE COLLECTING MECHANISM FOR WIRE-CUT ELECTRICAL DISCHARGE MACHINE

Chip carrier, semiconductor package and fabricating method thereof

Chip carrier, semiconductor package and fabricating method thereof