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Kaohsiung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Chip package and chip thereof
Patent number
10,797,213
Issue date
Oct 6, 2020
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip on film package and flexible substrate thereof
Patent number
10,580,729
Issue date
Mar 3, 2020
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and circuit substrate thereof
Patent number
10,504,828
Issue date
Dec 10, 2019
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and circuit substrate thereof
Patent number
10,340,216
Issue date
Jul 2, 2019
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Layout structure of flexible circuit board
Patent number
10,327,334
Issue date
Jun 18, 2019
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible substrate
Patent number
9,961,759
Issue date
May 1, 2018
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat dissipation package structure
Patent number
9,653,376
Issue date
May 16, 2017
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible substrate
Patent number
9,510,441
Issue date
Nov 29, 2016
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package structure and method for making the same
Patent number
9,159,660
Issue date
Oct 13, 2015
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing method and semiconductor structure thereof
Patent number
9,059,260
Issue date
Jun 16, 2015
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
9,000,569
Issue date
Apr 7, 2015
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
8,981,536
Issue date
Mar 17, 2015
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumping process and structure thereof
Patent number
8,841,767
Issue date
Sep 23, 2014
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor manufacturing method and semiconductor structure thereof
Patent number
8,823,169
Issue date
Sep 2, 2014
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
8,796,824
Issue date
Aug 5, 2014
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and lead frame thereof
Patent number
8,704,345
Issue date
Apr 22, 2014
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for making the same
Patent number
8,658,466
Issue date
Feb 25, 2014
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure
Patent number
8,581,384
Issue date
Nov 12, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin flip chip package structure
Patent number
8,497,571
Issue date
Jul 30, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure with compliant bump and manufacturing method th...
Patent number
8,476,159
Issue date
Jul 2, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thin flip chip package structure
Patent number
8,471,372
Issue date
Jun 25, 2013
Chipbound Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumping process and structure thereof
Patent number
8,450,203
Issue date
May 28, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate structure with compliant bump and manufacturing method th...
Patent number
8,426,984
Issue date
Apr 23, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Plate filter with high odor and toxin removing and water absorbing...
Patent number
5,783,080
Issue date
Jul 21, 1998
Chin-San Hsieh
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Multi-layer aerating filter
Patent number
5,223,129
Issue date
Jun 29, 1993
Chin-Hui Hsieh
C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240194646
Publication date
Jun 13, 2024
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
Publication number
20230378044
Publication date
Nov 23, 2023
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230187378
Publication date
Jun 15, 2023
Chipbond Technology Corporation
Shrane-Ning Jenq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230170301
Publication date
Jun 1, 2023
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DEVICE FOR COMPRESSION BONDING CHIP TO SUBSTRATE
Publication number
20210035947
Publication date
Feb 4, 2021
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DEVICE FOR COMPRESSION BONDING CHIP TO SUBSTRATE
Publication number
20200105712
Publication date
Apr 2, 2020
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND CHIP THEREOF
Publication number
20200091385
Publication date
Mar 19, 2020
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND CIRCUIT SUBSTRATE THEREOF
Publication number
20190279926
Publication date
Sep 12, 2019
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SUBSTRATE AND PROCESSING METHOD THEREOF
Publication number
20190252207
Publication date
Aug 15, 2019
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ON FILM PACKAGE AND FLEXIBLE SUBSTRATE THEREOF
Publication number
20190252298
Publication date
Aug 15, 2019
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE SUBSTRATE
Publication number
20170019984
Publication date
Jan 19, 2017
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE SUBSTRATE
Publication number
20160234927
Publication date
Aug 11, 2016
Chipbond Technology Corporation
Chin-Tang Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20150091141
Publication date
Apr 2, 2015
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20150069584
Publication date
Mar 12, 2015
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
Publication number
20140141606
Publication date
May 22, 2014
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
Publication number
20140027905
Publication date
Jan 30, 2014
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
Publication number
20140021601
Publication date
Jan 23, 2014
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF
Publication number
20130334671
Publication date
Dec 19, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
Publication number
20130334681
Publication date
Dec 19, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20130249070
Publication date
Sep 26, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
Publication number
20130213702
Publication date
Aug 22, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
Publication number
20130062756
Publication date
Mar 14, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
Publication number
20130065388
Publication date
Mar 14, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
Publication number
20130022830
Publication date
Jan 24, 2013
Chipbond Technology Corporation
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN FLIP CHIP PACKAGE STRUCTURE
Publication number
20120080783
Publication date
Apr 5, 2012
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN FLIP CHIP PACKAGE STRUCTURE
Publication number
20120074545
Publication date
Mar 29, 2012
Chin-Tang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Acoustic resonator device and method for manufacturing the same
Publication number
20060125577
Publication date
Jun 15, 2006
International Semiconductor Techonology Ltd.
Chin-Tang Hsieh
H03 - BASIC ELECTRONIC CIRCUITRY