Chin-Jong Chan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 10,879,251
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,770,469
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond-pad with pad edge strengthening structure
- Patent number 6,551,916
- Issue date Apr 22, 2003
- Winbond Electronics Corp.
- Shi-Tron Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bone-pad with pad edge strengthening structure
- Patent number 6,313,541
- Issue date Nov 6, 2001
- Winbond Electronics Corp.
- Chin-Jong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond-pad with a single anchoring structure
- Patent number 6,181,016
- Issue date Jan 30, 2001
- Winbond Electronics Corp.
- Shi-Tron Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for integrated circuit (I)
- Patent number 6,002,179
- Issue date Dec 14, 1999
- Winbond Electronics Corporation
- Chin-Jong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for integrated circuit (III)
- Patent number 5,962,919
- Issue date Oct 5, 1999
- Winbond Electronics Corp.
- Wen-Hao Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200027890
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Manufacturing Method Thereof
- Publication number 20180315765
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180182772
- Publication date Jun 28, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND-PAD WITH PAD EDGE STRENGTHENING STRUCTURE
- Publication number 20020115280
- Publication date Aug 22, 2002
- Shi-Tron Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond-pad with pad edge strengthening structure
- Publication number 20010020749
- Publication date Sep 13, 2001
- Shi-Tron Lin
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Jong Chan

Person

Patents Grantslast 30 patents

Integrated circuit and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Bond-pad with pad edge strengthening structure

Bone-pad with pad edge strengthening structure

Bond-pad with a single anchoring structure

Bonding pad structure for integrated circuit (I)

Bonding pad structure for integrated circuit (III)

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated Circuit and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BOND-PAD WITH PAD EDGE STRENGTHENING STRUCTURE

Bond-pad with pad edge strengthening structure