Chin-Kwan KIM

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with a substrate comprising protruding pad interconnects
- Patent number 11,776,888
- Issue date Oct 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,764,489
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employ...
- Patent number 11,756,894
- Issue date Sep 12, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform via pad structure having covered traces between partially c...
- Patent number 11,637,057
- Issue date Apr 25, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric antenna structure
- Patent number 11,258,165
- Issue date Feb 22, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,239,573
- Issue date Feb 1, 2022
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising recessed interconnects and a surface mounted p...
- Patent number 11,075,260
- Issue date Jul 27, 2021
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced antenna module with shield layer
- Patent number 11,043,740
- Issue date Jun 22, 2021
- QUALCOMM Incorporated
- Suhyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio interconnects in air gap of antenna package
- Patent number 10,734,332
- Issue date Aug 4, 2020
- QUALCOMM Incorporated
- Jon Bradley Lasiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising embedded package on package (PoP) device
- Patent number 10,510,733
- Issue date Dec 17, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with RF structure
- Patent number 10,431,511
- Issue date Oct 1, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal and electromagnetic interference shielding for die embedded...
- Patent number 10,410,971
- Issue date Sep 10, 2019
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array type inductor
- Patent number 10,403,707
- Issue date Sep 3, 2019
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside drill embedded die substrate
- Patent number 10,325,855
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising embedded package on package (PoP) device
- Patent number 10,163,871
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package-on-Package (PoP) device comprising a gap controller between...
- Patent number 9,947,642
- Issue date Apr 17, 2018
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced wafer level package comprising a core layer for reducing...
- Patent number 9,806,063
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive post protection for integrated circuit packages
- Patent number 9,768,108
- Issue date Sep 19, 2017
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method of forming the same
- Patent number 9,679,841
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge structure in a substrate
- Patent number 9,642,259
- Issue date May 2, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate comprising surface interconnect and cavity compri...
- Patent number 9,609,751
- Issue date Mar 28, 2017
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded components and method of making...
- Patent number 9,601,435
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with reduced height
- Patent number 9,484,327
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for split die interconnection
- Patent number 9,379,090
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Ahmer Raza Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with testing pads on fine pitch traces
- Patent number 9,370,097
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package interconnections and method of making the same
- Patent number 9,355,963
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish on trace for a thermal compression flip chip (TCFC)
- Patent number 9,269,681
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern between pattern for low profile substrate
- Patent number 9,269,610
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch and spacing interconnects for substrate
- Patent number 9,159,670
- Issue date Oct 13, 2015
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING A PACKAGE SUBSTRATE WITH A VERTICALLY-INT...
- Publication number 20230307817
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Suhyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS
- Publication number 20230073823
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING PROTRUDING PAD INTERCONNECTS
- Publication number 20220384328
- Publication date Dec 1, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20220131281
- Publication date Apr 28, 2022
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE SUBSTRATE WITH EMBEDDED TRACE SUBST...
- Publication number 20220068780
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20210376493
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) (RFIC) PACKAGES EMPLOY...
- Publication number 20210366838
- Publication date Nov 25, 2021
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING DISCRETE ANTENNA DEVICE
- Publication number 20210091017
- Publication date Mar 25, 2021
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ANTENNA MODULE WITH SHIELD LAYER
- Publication number 20200365983
- Publication date Nov 19, 2020
- QUALCOMM Incorporated
- Suhyung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM VIA PAD STRUCTURE
- Publication number 20200219803
- Publication date Jul 9, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC ANTENNA STRUCTURE
- Publication number 20200212545
- Publication date Jul 2, 2020
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING RECESSED INTERCONNECTS AND A SURFACE MOUNTED P...
- Publication number 20200135839
- Publication date Apr 30, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CAVITY FORMATION WITH MULTIPLE INTERCONNECTION PADS
- Publication number 20200091062
- Publication date Mar 19, 2020
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE HAVING REDUCED CONTACT PAD SIZE
- Publication number 20190371652
- Publication date Dec 5, 2019
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED CORNER PACKAGE FOR EMI SHIELD
- Publication number 20190341352
- Publication date Nov 7, 2019
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20190081027
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THERMAL AND ELECTROMAGNETIC INTERFERENCE SHIELDING FOR DIE EMBEDDED...
- Publication number 20190067205
- Publication date Feb 28, 2019
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO INTERCONNECTS IN AIR GAP OF ANTENNA PACKAGE
- Publication number 20190067221
- Publication date Feb 28, 2019
- QUALCOMM Incorporated
- Jon Bradley LASITER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER WITH RF STRUCTURE
- Publication number 20180316319
- Publication date Nov 1, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ARRAY TYPE INDUCTOR
- Publication number 20180286562
- Publication date Oct 4, 2018
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DRILL EMBEDDED DIE SUBSTRATE
- Publication number 20170271266
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN...
- Publication number 20170098633
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20170098634
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-PACKAGE CONNECTOR
- Publication number 20170084523
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...
- Publication number 20160322332
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20160247754
- Publication date Aug 25, 2016
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...
- Publication number 20160218064
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...
- Publication number 20160148864
- Publication date May 26, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Kwan KIM

Person

Patents Grantslast 30 patents

Providing a lower inductance path in a routing substrate for a capa...

Package with a substrate comprising protruding pad interconnects

Sub-module L-shaped millimeter wave antenna-in-package

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employ...

Uniform via pad structure having covered traces between partially c...

Asymmetric antenna structure

Sub-module L-shaped millimeter wave antenna-in-package

Substrate comprising recessed interconnects and a surface mounted p...

Enhanced antenna module with shield layer

High aspect ratio interconnects in air gap of antenna package

Integrated device comprising embedded package on package (PoP) device

Power amplifier with RF structure

Thermal and electromagnetic interference shielding for die embedded...

Array type inductor

Backside drill embedded die substrate

Integrated device comprising embedded package on package (PoP) device

Package-on-Package (PoP) device comprising a gap controller between...

Reinforced wafer level package comprising a core layer for reducing...

Conductive post protection for integrated circuit packages

Substrate and method of forming the same

Embedded bridge structure in a substrate

Package substrate comprising surface interconnect and cavity compri...

Semiconductor package with embedded components and method of making...

Package-on-package structure with reduced height

System, apparatus, and method for split die interconnection

Package substrate with testing pads on fine pitch traces

Semiconductor package interconnections and method of making the same

Surface finish on trace for a thermal compression flip chip (TCFC)

Pattern between pattern for low profile substrate

Ultra fine pitch and spacing interconnects for substrate

Patents Applicationslast 30 patents

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

ANTENNA MODULES EMPLOYING A PACKAGE SUBSTRATE WITH A VERTICALLY-INT...

PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS

PACKAGE WITH A SUBSTRATE COMPRISING PROTRUDING PAD INTERCONNECTS

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

INTEGRATED CIRCUIT (IC) PACKAGE SUBSTRATE WITH EMBEDDED TRACE SUBST...

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) (RFIC) PACKAGES EMPLOY...

PACKAGE COMPRISING DISCRETE ANTENNA DEVICE

ENHANCED ANTENNA MODULE WITH SHIELD LAYER

UNIFORM VIA PAD STRUCTURE

ASYMMETRIC ANTENNA STRUCTURE

SUBSTRATE COMPRISING RECESSED INTERCONNECTS AND A SURFACE MOUNTED P...

INTEGRATED CIRCUIT CAVITY FORMATION WITH MULTIPLE INTERCONNECTION PADS

INTEGRATED CIRCUIT CHIP PACKAGE HAVING REDUCED CONTACT PAD SIZE

TAPERED CORNER PACKAGE FOR EMI SHIELD

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

THERMAL AND ELECTROMAGNETIC INTERFERENCE SHIELDING FOR DIE EMBEDDED...

HIGH ASPECT RATIO INTERCONNECTS IN AIR GAP OF ANTENNA PACKAGE

POWER AMPLIFIER WITH RF STRUCTURE

ARRAY TYPE INDUCTOR

BACKSIDE DRILL EMBEDDED DIE SUBSTRATE

PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN...

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

ON-PACKAGE CONNECTOR

REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...

CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...

INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...