Chin Lee Kuan

Person

Bayan Lepas, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded bridge substrate having an integral device
- Patent number 11,749,606
- Issue date Sep 5, 2023
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical embedded component in a printed circuit board blind hole
- Patent number 11,696,409
- Issue date Jul 4, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor package and method of forming the same
- Patent number 11,562,963
- Issue date Jan 24, 2023
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench reference planes for integrated-circuit die packages
- Patent number 11,557,552
- Issue date Jan 17, 2023
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-component placement in multiple-damascene printed wiring bo...
- Patent number 11,540,395
- Issue date Dec 27, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped interposer for stacked chip package
- Patent number 11,527,479
- Issue date Dec 13, 2022
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a capacitive loop substrate assembly
- Patent number 11,521,943
- Issue date Dec 6, 2022
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic sensing scheme for voltage regulator circuit
- Patent number 11,502,603
- Issue date Nov 15, 2022
- Intel Corporation
- Amit Kumar Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structures to facilitate heat transfer within package layers to the...
- Patent number 11,437,294
- Issue date Sep 6, 2022
- Intel Corporation
- Sameer Shekhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shield to protect vias from electromagnetic interference
- Patent number 11,380,623
- Issue date Jul 5, 2022
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for reducing voltage overshoot in vol...
- Patent number 11,342,852
- Issue date May 24, 2022
- Intel Corporation
- Sameer Shekhar
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Crystal oscillator interconnect architecture with noise immunity
- Patent number 11,290,059
- Issue date Mar 29, 2022
- Intel Corporation
- Khang Choong Yong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Extended package air core inductor
- Patent number 11,264,160
- Issue date Mar 1, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge substrate having an integral device
- Patent number 11,133,256
- Issue date Sep 28, 2021
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor loop structure
- Patent number 11,031,359
- Issue date Jun 8, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors embedded in stiffeners for small form-factor and methods...
- Patent number 10,985,147
- Issue date Apr 20, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noise mitigation apparatus and method with positively and negativel...
- Patent number 10,719,109
- Issue date Jul 21, 2020
- Intel Corporation
- Amit K. Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crystal oscillator interconnect architecture with noise immunity
- Patent number 10,516,366
- Issue date Dec 24, 2019
- Intel Corporation
- Khang Choong Yong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Crystal oscillator interconnect architecture with noise immunity
- Patent number 10,171,033
- Issue date Jan 1, 2019
- Intel Corporation
- Khang Choong Yong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Inductor interconnect
- Patent number 10,083,922
- Issue date Sep 25, 2018
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device having an air core inductor
- Patent number 10,085,342
- Issue date Sep 25, 2018
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCODING DIFFERENTIAL SIGNALS FOR POWER AND NOISE REDUCTION
- Publication number 20240329715
- Publication date Oct 3, 2024
- Intel Corporation
- Amit K. Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY
- Publication number 20240145450
- Publication date May 2, 2024
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR LOW-LEAKAGE ON-CHIP CAPACITORS
- Publication number 20230317773
- Publication date Oct 5, 2023
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORM VOLTAGE REGULATOR CIRCUITRY CONFIGURATIONS
- Publication number 20230280814
- Publication date Sep 7, 2023
- Sameer Shekhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WARPAGE CONTROL
- Publication number 20230124098
- Publication date Apr 20, 2023
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER AND SOCKET EMBEDDED METAL INSERT ARCHITECTURES FOR POWER...
- Publication number 20220199551
- Publication date Jun 23, 2022
- Intel Corporation
- Amit Kumar JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR 2.5D PACKAGING ARCHITECTURE
- Publication number 20220077065
- Publication date Mar 10, 2022
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Boards with Embedded Planes
- Publication number 20210410273
- Publication date Dec 30, 2021
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210384135
- Publication date Dec 9, 2021
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE
- Publication number 20210335712
- Publication date Oct 28, 2021
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR LOOP STRUCTURE
- Publication number 20210233875
- Publication date Jul 29, 2021
- Intel Corporation
- Jenny Shio Yin ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH REFERENCE PLANES FOR INTEGRATED-CIRCUIT DIE PACKAGES
- Publication number 20200395318
- Publication date Dec 17, 2020
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY
- Publication number 20200274491
- Publication date Aug 27, 2020
- Intel Corporation
- Khang Choong YONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED-COMPONENT PLACEMENT IN MULTIPLE-DAMASCENE PRINTED WIRING BO...
- Publication number 20200128673
- Publication date Apr 23, 2020
- Bok Eng Cheah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE EDGE MOUNTED FRAME STRUCTURES
- Publication number 20200098674
- Publication date Mar 26, 2020
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES TO FACILITATE HEAT TRANSFER WITHIN PACKAGE LAYERS TO THE...
- Publication number 20200051884
- Publication date Feb 13, 2020
- Intel Corporation
- Sameer SHEKHAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXTENDED PACKAGE AIR CORE INDUCTOR
- Publication number 20200027639
- Publication date Jan 23, 2020
- INTEL CORPORATION
- Eng Huat Goh
- G05 - CONTROLLING REGULATING
Information Patent Application
MAGNETIC SENSING SCHEME FOR VOLTAGE REGULATOR CIRCUIT
- Publication number 20190312513
- Publication date Oct 10, 2019
- Amit Kumar Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE
- Publication number 20190304915
- Publication date Oct 3, 2019
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD TO PROTECT VIAS FROM ELECTROMAGNETIC INTERFERENCE
- Publication number 20190304923
- Publication date Oct 3, 2019
- Intel Corporation
- Sameer SHEKHAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR LOOP STRUCTURE
- Publication number 20190279949
- Publication date Sep 12, 2019
- Intel Corporation
- Jenny Shio Yin ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
- Publication number 20190208643
- Publication date Jul 4, 2019
- Intel Corporation
- Tin Poay CHUAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY
- Publication number 20190158024
- Publication date May 23, 2019
- Intel Corporation
- Khang Choong YONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CAPACITORS EMBEDDED IN STIFFENERS FOR SMALL FORM-FACTOR AND METHODS...
- Publication number 20190006333
- Publication date Jan 3, 2019
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR REDUCING VOLTAGE OVERSHOOT IN VOL...
- Publication number 20180375438
- Publication date Dec 27, 2018
- Intel Corporation
- Sameer Shekhar
- G05 - CONTROLLING REGULATING
Information Patent Application
NOISE MITIGATION APPARATUS AND METHOD WITH POSITIVELY AND NEGATIVEL...
- Publication number 20180364775
- Publication date Dec 20, 2018
- Intel Corporation
- Amit K. Jain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICE HAVING AN AIR CORE INDUCTOR
- Publication number 20180168043
- Publication date Jun 14, 2018
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR INTERCONNECT
- Publication number 20180145042
- Publication date May 24, 2018
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY
- Publication number 20180123514
- Publication date May 3, 2018
- Intel Corporation
- Khang Choong YONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COMPACT PARTITIONED CAPACITOR FOR MULTIPLE VOLTAGE DOMAINS WITH IMP...
- Publication number 20170373587
- Publication date Dec 28, 2017
- Intel Corporation
- Chin Lee Kuan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Chin Lee Kuan

Person

Patents Grantslast 30 patents

Embedded bridge substrate having an integral device

Vertical embedded component in a printed circuit board blind hole

Stacked semiconductor package and method of forming the same

3D trench reference planes for integrated-circuit die packages

Stacked-component placement in multiple-damascene printed wiring bo...

Stepped interposer for stacked chip package

Method of forming a capacitive loop substrate assembly

Magnetic sensing scheme for voltage regulator circuit

Structures to facilitate heat transfer within package layers to the...

Shield to protect vias from electromagnetic interference

Apparatus, system, and method for reducing voltage overshoot in vol...

Crystal oscillator interconnect architecture with noise immunity

Extended package air core inductor

Embedded bridge substrate having an integral device

Capacitor loop structure

Capacitors embedded in stiffeners for small form-factor and methods...

Noise mitigation apparatus and method with positively and negativel...

Crystal oscillator interconnect architecture with noise immunity

Crystal oscillator interconnect architecture with noise immunity

Inductor interconnect

Microelectronic device having an air core inductor

Patents Applicationslast 30 patents

ENCODING DIFFERENTIAL SIGNALS FOR POWER AND NOISE REDUCTION

PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY

TECHNOLOGIES FOR LOW-LEAKAGE ON-CHIP CAPACITORS

PLATFORM VOLTAGE REGULATOR CIRCUITRY CONFIGURATIONS

SEMICONDUCTOR PACKAGE WITH WARPAGE CONTROL

STIFFENER AND SOCKET EMBEDDED METAL INSERT ARCHITECTURES FOR POWER...

INTERPOSER FOR 2.5D PACKAGING ARCHITECTURE

Hybrid Boards with Embedded Planes

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE

CAPACITOR LOOP STRUCTURE

3D TRENCH REFERENCE PLANES FOR INTEGRATED-CIRCUIT DIE PACKAGES

CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY

STACKED-COMPONENT PLACEMENT IN MULTIPLE-DAMASCENE PRINTED WIRING BO...

PACKAGE EDGE MOUNTED FRAME STRUCTURES

STRUCTURES TO FACILITATE HEAT TRANSFER WITHIN PACKAGE LAYERS TO THE...

EXTENDED PACKAGE AIR CORE INDUCTOR

MAGNETIC SENSING SCHEME FOR VOLTAGE REGULATOR CIRCUIT

EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE

SHIELD TO PROTECT VIAS FROM ELECTROMAGNETIC INTERFERENCE

CAPACITOR LOOP STRUCTURE

VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE

CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY

CAPACITORS EMBEDDED IN STIFFENERS FOR SMALL FORM-FACTOR AND METHODS...

APPARATUS, SYSTEM, AND METHOD FOR REDUCING VOLTAGE OVERSHOOT IN VOL...

NOISE MITIGATION APPARATUS AND METHOD WITH POSITIVELY AND NEGATIVEL...

MICROELECTRONIC DEVICE HAVING AN AIR CORE INDUCTOR

INDUCTOR INTERCONNECT

CRYSTAL OSCILLATOR INTERCONNECT ARCHITECTURE WITH NOISE IMMUNITY

COMPACT PARTITIONED CAPACITOR FOR MULTIPLE VOLTAGE DOMAINS WITH IMP...