Chin Teck Siong

Person

Sungai Buloh, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with bond wire reinforcement structure
- Patent number 11,056,457
- Issue date Jul 6, 2021
- NXP USA, INC.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with reservoir for die attach adhesive
- Patent number 10,325,826
- Issue date Jun 18, 2019
- NXP USA, INC.
- Ly Hoon Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaged integrated circuit
- Patent number 9,287,236
- Issue date Mar 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond interface structure and formation
- Patent number 9,257,403
- Issue date Feb 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated wire bonding with EFO before second bond
- Patent number 9,165,904
- Issue date Oct 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solar powered IC chip
- Patent number 8,809,078
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar powered IC chip
- Patent number 8,778,704
- Issue date Jul 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR
- Publication number 20250069903
- Publication date Feb 27, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE
- Publication number 20230369168
- Publication date Nov 16, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE
- Publication number 20200105709
- Publication date Apr 2, 2020
- NXP USA, Inc.
- Boon Yew Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGED INTEGRATED CIRCUIT
- Publication number 20160020189
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Interface Structure and Formation
- Publication number 20150145148
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR POWERED IC CHIP
- Publication number 20140225211
- Publication date Aug 14, 2014
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS

Chin Teck Siong

Person

Patents Grantslast 30 patents

Semiconductor device with bond wire reinforcement structure

Substrate with reservoir for die attach adhesive

Flexible packaged integrated circuit

Copper ball bond interface structure and formation

Insulated wire bonding with EFO before second bond

Solar powered IC chip

Solar powered IC chip

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...

PACKAGE HAVING METAL SKELETON FRAME USING EMBEDDED GROUND PLANE

SEMICONDUCTOR DEVICE WITH BOND WIRE REINFORCEMMENT STRUCTURE

FLEXIBLE PACKAGED INTEGRATED CIRCUIT

Copper Ball Bond Interface Structure and Formation

SOLAR POWERED IC CHIP

MULTI-CORE WIRE