Chin Tung SO

Follow

Person

Kwai Chung, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING
- Publication number 20130316294
- Publication date Nov 28, 2013
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS