Chin-Twan Wei

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method to form multile electrical components and a single electrica...
- Patent number 11,915,855
- Issue date Feb 27, 2024
- Cyntec Co., Ltd.
- Chin Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid thermal treatment to eliminate metal void formation in VLSI m...
- Patent number 5,248,384
- Issue date Sep 28, 1993
- Taiwan Semiconductor Manufacturing Company
- Kwang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO FORM MULTILE ELECTRICAL COMPONENTS AND A SINGLE ELECTRICA...
- Publication number 20240242880
- Publication date Jul 18, 2024
- CYNTEC CO., LTD.
- Chin Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM MULTILE ELECTRICAL COMPONENTS AND A SINGLE ELECTRICA...
- Publication number 20200303118
- Publication date Sep 24, 2020
- CYNTEC CO., LTD.
- Chin Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS