Chin-Wei Liang

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging method and package structure
- Patent number 12,224,221
- Issue date Feb 11, 2025
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 12,113,090
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic frame rate adjustment mechanism
- Patent number 11,974,071
- Issue date Apr 30, 2024
- Mediatek Inc.
- Kang-Yi Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 11,887,929
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,869,916
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched-capacitor power stage and switched-capacitor converter
- Patent number 11,824,449
- Issue date Nov 21, 2023
- Novatek Microelectronics Corp.
- Ke Horng Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device with high heat dissipation efficiency
- Patent number 11,699,675
- Issue date Jul 11, 2023
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 11,495,532
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic frame rate adjustment mechanism
- Patent number 11,457,173
- Issue date Sep 27, 2022
- Mediatek Inc.
- Kang-Yi Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensors with organic photodiodes and methods for forming the...
- Patent number 11,404,484
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer bonding
- Patent number 11,348,790
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP apparatus and method for estimating film thickness
- Patent number 11,133,231
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Min Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and methods of manufacturing thereof
- Patent number 11,049,767
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme to improve peeling in chalcogenide based PCRAM
- Patent number 11,024,800
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing system and method
- Patent number 10,967,479
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,910,260
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic photosensitive device with an electron-blocking and hole-tr...
- Patent number 10,818,857
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Wei Liang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Image sensors with organic photodiodes and methods for forming the...
- Patent number 10,748,967
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer bonding
- Patent number 10,636,661
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme to improve peeling in chalcogenide based PCRAM
- Patent number 10,622,555
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hai-Dang Trinh
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,510,587
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adjusting the adaptive screen-refresh rate and device th...
- Patent number 10,380,968
- Issue date Aug 13, 2019
- MediaTek Singapore Pte Ltd.
- Xuecheng Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chemical mechanical polishing system and method
- Patent number 10,350,726
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Wei Liang
- B24 - GRINDING POLISHING
Information Patent Grant
High K scheme to improve retention performance of resistive random...
- Patent number 10,193,065
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Trinh Hai Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Getter, MEMS device and method of forming the same
- Patent number 10,155,214
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Wei Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,115,896
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with organic photodiodes and methods for forming the...
- Patent number 10,008,546
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing method and apparatus and system for dynamically ad...
- Patent number 9,973,707
- Issue date May 15, 2018
- Mediatek Inc.
- Chun-Ming Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of fabricating an organic photodiode with dual electron bloc...
- Patent number 9,960,353
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic photosensitive device with an electron-blocking and hole-tr...
- Patent number 9,876,184
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20240355864
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186308
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC
- Publication number 20240186238
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTERCONNECT STRUCTURES
- Publication number 20240113032
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20230378225
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW BORDER REFLECTIVE DISPLAY DEVICE
- Publication number 20230351934
- Publication date Nov 2, 2023
- E Ink Holdings Inc.
- Chen-Yun MA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20230343666
- Publication date Oct 26, 2023
- HARVATEK CORPORATION
- Chin-Jui LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR MULTI-CHIP DEVICE
- Publication number 20230215786
- Publication date Jul 6, 2023
- HARVATEK CORPORATION
- CHIN-JUI LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TYPE MULTI-CHIP DEVICE
- Publication number 20230215785
- Publication date Jul 6, 2023
- HARVATEK CORPORATION
- CHIN-JUI LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHED-CAPACITOR POWER STAGE AND SWITCHED-CAPACITOR CONVERTER
- Publication number 20230128793
- Publication date Apr 27, 2023
- NOVATEK MICROELECTRONICS CORP.
- Ke Horng CHEN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DYNAMIC FRAME RATE ADJUSTMENT MECHANISM
- Publication number 20220408054
- Publication date Dec 22, 2022
- MEDIATEK INC.
- Kang-Yi Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC
- Publication number 20220367342
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY
- Publication number 20220359451
- Publication date Nov 10, 2022
- HARVATEK CORPORATION
- Chin-Jui LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMBOL-POWER-TRACKING SUPPLY, AND WIRELESS DEVICE USING AMPLIFICATI...
- Publication number 20220321060
- Publication date Oct 6, 2022
- MEDIATEK INC.
- Kuo-Chun HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND METHOD FOR WAFER BONDING
- Publication number 20220285156
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YEONG-JYH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20220157875
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF
- Publication number 20210327748
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC
- Publication number 20210272896
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC FRAME RATE ADJUSTMENT MECHANISM
- Publication number 20210266495
- Publication date Aug 26, 2021
- MEDIATEK INC.
- Kang-Yi Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image Sensors with Organic Photodiodes and Methods for Forming the...
- Publication number 20200373357
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER BONDING
- Publication number 20200258743
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YEONG-JYH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME TO IMPROVE PEELING IN CHALCOGENIDE BASED PCRAM
- Publication number 20200161544
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF
- Publication number 20200135538
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200058545
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME TO IMPROVE PEELING IN CHALCOGENIDE BASED PCRAM
- Publication number 20200044148
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hai-Dang Trinh
- G11 - INFORMATION STORAGE
Information Patent Application
CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD
- Publication number 20190291236
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Wei Liang
- B24 - GRINDING POLISHING
Information Patent Application
CMP APPARATUS AND METHOD FOR ESTIMATING FILM THICKNESS
- Publication number 20190157170
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-MIN CHEN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190103307
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD
- Publication number 20180361529
- Publication date Dec 20, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Wei Liang

Person

Patents Grantslast 30 patents

Packaging method and package structure

Bond pad structure for bonding improvement

Dynamic frame rate adjustment mechanism

Techniques to inhibit delamination from flowable gap-fill dielectric

Bond pad structure for bonding improvement

Switched-capacitor power stage and switched-capacitor converter

Semiconductor device with high heat dissipation efficiency

Techniques to inhibit delamination from flowable gap-fill dielectric

Dynamic frame rate adjustment mechanism

Image sensors with organic photodiodes and methods for forming the...

Apparatus and method for wafer bonding

CMP apparatus and method for estimating film thickness

Semiconductor device and methods of manufacturing thereof

Film scheme to improve peeling in chalcogenide based PCRAM

Chemical mechanical polishing system and method

Method for manufacturing semiconductor device

Organic photosensitive device with an electron-blocking and hole-tr...

Image sensors with organic photodiodes and methods for forming the...

Apparatus and method for wafer bonding

Film scheme to improve peeling in chalcogenide based PCRAM

Method for manufacturing semiconductor device

Method for adjusting the adaptive screen-refresh rate and device th...

Chemical mechanical polishing system and method

High K scheme to improve retention performance of resistive random...

Getter, MEMS device and method of forming the same

Semiconductor device and method of manufacturing the same

Image sensors with organic photodiodes and methods for forming the...

Image processing method and apparatus and system for dynamically ad...

Method of fabricating an organic photodiode with dual electron bloc...

Organic photosensitive device with an electron-blocking and hole-tr...

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC

PACKAGED INTERCONNECT STRUCTURES

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

NARROW BORDER REFLECTIVE DISPLAY DEVICE

PACKAGING METHOD AND PACKAGE STRUCTURE

PLANAR MULTI-CHIP DEVICE

VERTICAL TYPE MULTI-CHIP DEVICE

SWITCHED-CAPACITOR POWER STAGE AND SWITCHED-CAPACITOR CONVERTER

DYNAMIC FRAME RATE ADJUSTMENT MECHANISM

TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC

SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY

SYMBOL-POWER-TRACKING SUPPLY, AND WIRELESS DEVICE USING AMPLIFICATI...

APPARATUS AND METHOD FOR WAFER BONDING

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF

TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC

DYNAMIC FRAME RATE ADJUSTMENT MECHANISM

Image Sensors with Organic Photodiodes and Methods for Forming the...

APPARATUS AND METHOD FOR WAFER BONDING

FILM SCHEME TO IMPROVE PEELING IN CHALCOGENIDE BASED PCRAM

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FILM SCHEME TO IMPROVE PEELING IN CHALCOGENIDE BASED PCRAM

CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD

CMP APPARATUS AND METHOD FOR ESTIMATING FILM THICKNESS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD