Chin-Yi Cho

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for integrated microphone
- Patent number 11,678,133
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a microphone
- Patent number 10,779,100
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a microphone
- Patent number 9,998,843
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for a wafer seal ring
- Patent number 9,673,169
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing waste of substrate and waste removing device the...
- Patent number 9,545,691
- Issue date Jan 17, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Yi Cho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolithic complementary metal-oxide semiconductor (CMOS)-integrate...
- Patent number 9,462,402
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yi Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level packaging techniques
- Patent number 9,269,679
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method for integrated microphone
- Patent number 9,264,833
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for post-bonding wafer edge seal
- Patent number 8,841,201
- Issue date Sep 23, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer structure and method for wafer to wafer bonding
- Patent number 8,686,571
- Issue date Apr 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure and Method for Integrated Microphone
- Publication number 20200413210
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and Method for Integrated Microphone
- Publication number 20180288549
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHIC COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) - INTEGRA...
- Publication number 20160241979
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Yi Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Structure and Method for Integrated Microphone
- Publication number 20160157038
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF REMOVING WASTE OF SUBSTRATE AND WASTE REMOVING DEVICE THE...
- Publication number 20150174700
- Publication date Jun 25, 2015
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- CHIN-YI CHO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGING TECHNIQUES
- Publication number 20150123129
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Integrated Microphone
- Publication number 20140270272
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL
- Publication number 20140231967
- Publication date Aug 21, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for a Wafer Seal Ring
- Publication number 20140220735
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING
- Publication number 20140042625
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Yi Cho

Person

Patents Grantslast 30 patents

Structure for integrated microphone

Method for manufacturing a microphone

Method for manufacturing a microphone

Method and apparatus for a wafer seal ring

Method of removing waste of substrate and waste removing device the...

Monolithic complementary metal-oxide semiconductor (CMOS)-integrate...

Wafer level packaging techniques

Structure and method for integrated microphone

Systems and methods for post-bonding wafer edge seal

Bonding layer structure and method for wafer to wafer bonding

Patents Applicationslast 30 patents

Structure and Method for Integrated Microphone

Structure and Method for Integrated Microphone

MONOLITHIC COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) - INTEGRA...

Structure and Method for Integrated Microphone

METHOD OF REMOVING WASTE OF SUBSTRATE AND WASTE REMOVING DEVICE THE...

WAFER LEVEL PACKAGING TECHNIQUES

Structure and Method for Integrated Microphone

SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL

Method and Apparatus for a Wafer Seal Ring

BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING