Chin Yuan Hung

Person

Fengyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure having tapering support bars and leads
- Patent number 6,696,749
- Issue date Feb 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 6,680,531
- Issue date Jan 20, 2004
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,509,636
- Issue date Jan 21, 2003
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 6,495,908
- Issue date Dec 17, 2002
- Siliconware Precision Industries, Co., Ltd.
- Cheng-Hsung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-die package structure and method for fabricating the same
- Patent number 6,476,474
- Issue date Nov 5, 2002
- Siliconware Precision Industries Co., Ltd.
- Chin Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded package structure for housing CMOS sensor
- Patent number 6,476,469
- Issue date Nov 5, 2002
- Siliconware Precision Industries Co., Ltd.
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided chip package without a die pad
- Patent number 6,437,447
- Issue date Aug 20, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electricity storage device
- Patent number 6,423,450
- Issue date Jul 23, 2002
- Chin-Lien Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with dot array of silver-plated regions on die pad for us...
- Patent number 6,396,129
- Issue date May 28, 2002
- Siliconware Precision Industries Co., Ltd.
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-chip semiconductor package
- Publication number 20030047754
- Publication date Mar 13, 2003
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR PACKAGE
- Publication number 20020149103
- Publication date Oct 17, 2002
- Siliconware Precision Industries Co., Ltd.
- Cheng-Hsung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package of an image sensor device
- Publication number 20020060358
- Publication date May 23, 2002
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat non-leaded package structure for housing CMOS sensor
- Publication number 20020060357
- Publication date May 23, 2002
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS

Chin Yuan Hung

Person

Patents Grantslast 30 patents

Package structure having tapering support bars and leads

Multi-chip semiconductor package

Semiconductor package

Multi-chip semiconductor package

Dual-die package structure and method for fabricating the same

Quad flat non-leaded package structure for housing CMOS sensor

Dual-sided chip package without a die pad

Electricity storage device

Leadframe with dot array of silver-plated regions on die pad for us...

Patents Applicationslast 30 patents

Multi-chip semiconductor package

MULTI-CHIP SEMICONDUCTOR PACKAGE

Package of an image sensor device

Quad flat non-leaded package structure for housing CMOS sensor