TREA

CHINAMI MARUSHIMA

Follow

Person

  • Urayasu-city, JP
People

Patents Applicationslast 30 patents

  • Information Patent Application

    TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
    • Publication number 20240112965
    • Publication date Apr 4, 2024
    • International Business Machines Corporation
    • Chinami Marushima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTICHIP INTERCONNECT PACKAGE
    • Publication number 20230307307
    • Publication date Sep 28, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
    • Publication number 20230307372
    • Publication date Sep 28, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNDERFILL VACUUM PROCESS
    • Publication number 20230178445
    • Publication date Jun 8, 2023
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS