Ching C. Lee

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding surface and bonding method
- Patent number 6,265,300
- Issue date Jul 24, 2001
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure having an interposed rigid layer
- Patent number 5,567,981
- Issue date Oct 22, 1996
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS