Ching-Chuan Hsieh

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure having thermoelectric cooler
- Patent number 12,368,086
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor device and manufacturing method of molded semi...
- Patent number 12,358,194
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,997
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,334,424
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration handling at a user device
- Patent number 12,328,628
- Issue date Jun 10, 2025
- Google LLC
- Chih-Hsiang Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,322,640
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,300,684
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,261,088
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fiber winding machine with full-time tension control function
- Patent number 12,258,238
- Issue date Mar 25, 2025
- Ching-Lu Hsieh
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,230,549
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spherical multi-axis optical fiber sensing device, assembling metho...
- Patent number 12,209,867
- Issue date Jan 28, 2025
- AEGIVERSE Co., Ltd.
- Hung-Pin Chung
- G01 - MEASURING TESTING
Information Patent Grant
Connector and method for manufacturing the same
- Patent number 12,184,005
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method and system
- Patent number 12,176,319
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,176,279
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,064
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a radio resource control cell group configuration
- Patent number 12,101,846
- Issue date Sep 24, 2024
- Google LLC
- Chih-Hsiang Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for handling a radio resource control cell group configuration
- Patent number 12,101,845
- Issue date Sep 24, 2024
- Google LLC
- Chih-Hsiang Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,062,832
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250233111
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201640
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250204074
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20250201621
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192011
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD...
- Publication number 20250172774
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih LIN
- G02 - OPTICS
Information Patent Application
CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE
- Publication number 20250172777
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20250167060
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS
- Publication number 20250149495
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250147245
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250140643
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250105536
- Publication date Mar 27, 2025
- Unimicron Technology Corp.
- Ra-Min TAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250093593
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Lin
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087571
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20250070077
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESUMING A RADIO CONNECTION IN MULTI- RADIO DUAL CONNECTIVITY
- Publication number 20250071845
- Publication date Feb 27, 2025
- Google LLC
- Ching-Jung Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Enabling Paging Occasions of Idle State for Inactive State
- Publication number 20250071730
- Publication date Feb 27, 2025
- Chih-Hsiang WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Package With Thermal Conductive Structure and the Met...
- Publication number 20250062181
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CANDIDATE CELL CONFIGURATIONS FOR CONDITIONAL PREPARATION...
- Publication number 20250063457
- Publication date Feb 20, 2025
- Google LLC
- Ching- Jung Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250054892
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auto Recipe Generation and Dicing Process
- Publication number 20240429101
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404932
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE
- Publication number 20240404954
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SUBSTRATE HANDLING
- Publication number 20240379404
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371813
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Chuan Hsieh

Person

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Package structure having thermoelectric cooler

Methods of forming semiconductor packages

Molded semiconductor device and manufacturing method of molded semi...

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Configuration handling at a user device

Semiconductor package and manufacturing method thereof

Aligning bumps in fan-out packaging process

Semiconductor packages

Semiconductor package and method of forming the same

Method of manufacturing semiconductor package, method of handling w...

Package structure and method of forming the same

Optical fiber winding machine with full-time tension control function

Three-dimensional integrated circuit structures and methods of form...

Package structure with warpage-control element

Package structure

Spherical multi-axis optical fiber sensing device, assembling metho...

Connector and method for manufacturing the same

Reflow method and system

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Package structure with fan-out feature

Semiconductor package and manufacturing method thereof

Method for handling a radio resource control cell group configuration

Method for handling a radio resource control cell group configuration

Circuit board assembly

Formation method of chip package with fan-out structure

Electronic device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD...

CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

SEMICONDUCTOR PACKAGE AND METHODS

PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

PACKAGE STRUCTURE

CONNECTOR AND MANUFACTURING METHOD THEREOF

OPTICAL DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

REFLOW METHOD AND SYSTEM

RESUMING A RADIO CONNECTION IN MULTI- RADIO DUAL CONNECTIVITY

Enabling Paging Occasions of Idle State for Inactive State

Semiconductor Package With Thermal Conductive Structure and the Met...

MANAGING CANDIDATE CELL CONFIGURATIONS FOR CONDITIONAL PREPARATION...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Auto Recipe Generation and Dicing Process

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING PACKAGE

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

APPARATUS AND METHOD FOR SUBSTRATE HANDLING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF