Ching-Fa YANG

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,224,335
- Issue date Feb 11, 2025
- United Microelectronics Corp.
- Ching-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning apparatus for positioning spring product fed from sprin...
- Patent number 12,208,438
- Issue date Jan 28, 2025
- PLUSPRINGS MACHINERY CO., LTD
- Ching-Fa Yang
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor package with shared barrier layer in redistribution a...
- Patent number 12,211,823
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including interconnection to probe pad with...
- Patent number 12,205,856
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-phase immersion-type composite heat dissipation device
- Patent number 12,207,445
- Issue date Jan 21, 2025
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 12,176,257
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,161,057
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsing-Lien Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Two-phase immersion-type heat dissipation structure having porous s...
- Patent number 12,156,376
- Issue date Nov 26, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Urine monitoring method and physiological monitoring system
- Patent number 12,152,923
- Issue date Nov 26, 2024
- Mikotek Information Inc.
- Ching-Wen Yang
- G08 - SIGNALLING
Information Patent Grant
Memory device structure for reducing thermal crosstalk
- Patent number 12,150,394
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching Ju Yang
Information Patent Grant
Heat-dissipating substrate structure
- Patent number 12,140,386
- Issue date Nov 12, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for coating photoresist over a substrate
- Patent number 12,124,168
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Key management system providing secure management of cryptographic...
- Patent number 12,113,895
- Issue date Oct 8, 2024
- PUFsecurity Corporation
- Yung-Hsiang Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-phase immersion-type heat dissipation structure having fins for...
- Patent number 12,108,574
- Issue date Oct 1, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase immersion-type heat dissipation structure having non-vert...
- Patent number 12,092,406
- Issue date Sep 17, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device including pripheral region having semiconductor l...
- Patent number 12,085,820
- Issue date Sep 10, 2024
- Innolux Corporation
- Chen-Kuan Kao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Transistor structure
- Patent number 12,087,635
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Shih-Yin Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system with a cooling device with at least a pressing po...
- Patent number 12,066,876
- Issue date Aug 20, 2024
- ASUSTeK COMPUTER Inc.
- Kuo-Chin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power supply circuit and power supplying method
- Patent number 12,068,598
- Issue date Aug 20, 2024
- Realtek Semiconductor Corporation
- Ching-Lan Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device
- Patent number 12,063,320
- Issue date Aug 13, 2024
- ASUSTeK COMPUTER Inc.
- Cheng-Han Chung
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 12,046,480
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shou Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain epitaxial layer
- Patent number 11,996,323
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal product, method for manufacturing the metal product, and meta...
- Patent number 11,993,863
- Issue date May 28, 2024
- Fulian Yuzhan Precision Technology Co., Ltd
- Yu-Mei Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Liquid-cooling heat dissipation plate with pin-fins and enclosed li...
- Patent number 11,988,467
- Issue date May 21, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Portable electronic device
- Patent number 11,903,169
- Issue date Feb 13, 2024
- ASUSTeK COMPUTER Inc.
- Cheng-Han Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and functional module thereof
- Patent number 11,901,791
- Issue date Feb 13, 2024
- ASUSTeK COMPUTER Inc.
- Chia-Min Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 11,887,929
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Random number generator and method of generating output random number
- Patent number 11,876,899
- Issue date Jan 16, 2024
- PUFsecurity Corporation
- Meng-Yi Wu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR STRUCTURE
- Publication number 20250048671
- Publication date Feb 6, 2025
- United Microelectronics Corp.
- Hsuan-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration System for Green Energy Agricultural Park
- Publication number 20250037140
- Publication date Jan 30, 2025
- Season Agricultural Technology Co., Ltd.
- Ching-Chieh Yang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250031438
- Publication date Jan 23, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEYCAP AND MANUFACTURING METHOD THEREOF
- Publication number 20240395481
- Publication date Nov 28, 2024
- CHICONY ELECTRONICS CO., LTD.
- Ching-Wu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240393647
- Publication date Nov 28, 2024
- InnoLux Corporation
- Chen-Kuan Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Food Processor
- Publication number 20240381908
- Publication date Nov 21, 2024
- Season Agricultural Technology Co., Ltd.
- Ching-Chieh Yang
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE
- Publication number 20240377750
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20240379382
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOMASK AND METHOD FOR INSPECTING PHOTOMASK
- Publication number 20240377728
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIEN-HUNG LAI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MEMORY DEVICE STRUCTURE FOR REDUCING THERMAL CROSSTALK
- Publication number 20240381797
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Ju Yang
Information Patent Application
COOLING STRUCTURE HAVING METAL PLATING LAYER
- Publication number 20240344783
- Publication date Oct 17, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PARALLEL MODULE DRIVER
- Publication number 20240334634
- Publication date Oct 3, 2024
- Delta Electronics, Inc.
- Ching-Chi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE
- Publication number 20240295371
- Publication date Sep 5, 2024
- Amulaire thermal technology, INC.
- KUO-WEI LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290652
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SKIVE...
- Publication number 20240280332
- Publication date Aug 22, 2024
- Amulaire thermal technology, INC.
- YU-WEI CHIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORT...
- Publication number 20240276676
- Publication date Aug 15, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SKIVE...
- Publication number 20240268078
- Publication date Aug 8, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-TYPE COMPOSITE HEAT DISSIPATION DEVICE
- Publication number 20240244797
- Publication date Jul 18, 2024
- Amulaire thermal technology, INC.
- CHUN-TE WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION DEVICE HAVING REINFORCED...
- Publication number 20240244793
- Publication date Jul 18, 2024
- Amulaire thermal technology, INC.
- CHUN-TE WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EDMOS AND FABRICATING METHOD OF THE SAME
- Publication number 20240234572
- Publication date Jul 11, 2024
- UNITED MICROELECTRONICS CORP.
- Liang-An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC
- Publication number 20240186238
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION COMPOSITE STRUCTURE HA...
- Publication number 20240155808
- Publication date May 9, 2024
- Amulaire thermal technology, INC.
- CHUN-TE WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING FINS FOR...
- Publication number 20240155809
- Publication date May 9, 2024
- Amulaire thermal technology, INC.
- CHUN-TE WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING ACUTE-AN...
- Publication number 20240155807
- Publication date May 9, 2024
- Amulaire thermal technology, INC.
- CHUN-TE WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING NON-VERT...
- Publication number 20240142180
- Publication date May 2, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PORTABLE ELECTRONIC DEVICE
- Publication number 20240143050
- Publication date May 2, 2024
- ASUSTek COMPUTER INC.
- Cheng-Han Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING POROUS S...
- Publication number 20240147662
- Publication date May 2, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ching-Fa YANG

Person

Patents Grantslast 30 patents

Semiconductor device and fabrication method thereof

Positioning apparatus for positioning spring product fed from sprin...

Semiconductor package with shared barrier layer in redistribution a...

Semiconductor structure including interconnection to probe pad with...

Two-phase immersion-type composite heat dissipation device

Semiconductor structure having an anti-arcing pattern disposed on a...

Method for forming semiconductor structure

Two-phase immersion-type heat dissipation structure having porous s...

Urine monitoring method and physiological monitoring system

Memory device structure for reducing thermal crosstalk

Heat-dissipating substrate structure

Semiconductor package and manufacturing method thereof

Method and apparatus for coating photoresist over a substrate

Key management system providing secure management of cryptographic...

Two-phase immersion-type heat dissipation structure having fins for...

Two-phase immersion-type heat dissipation structure having non-vert...

Electronic device including pripheral region having semiconductor l...

Transistor structure

Electronic system with a cooling device with at least a pressing po...

Power supply circuit and power supplying method

Electronic device

Manufacturing method of a semiconductor device

Semiconductor device with source/drain epitaxial layer

Metal product, method for manufacturing the metal product, and meta...

Liquid-cooling heat dissipation plate with pin-fins and enclosed li...

Portable electronic device

Electronic device and functional module thereof

Methods of manufacturing a semiconductor device including a joint a...

Techniques to inhibit delamination from flowable gap-fill dielectric

Random number generator and method of generating output random number

Patents Applicationslast 30 patents

TRANSISTOR STRUCTURE

Configuration System for Green Energy Agricultural Park

SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

KEYCAP AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

Food Processor

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

PHOTOMASK AND METHOD FOR INSPECTING PHOTOMASK

MEMORY DEVICE STRUCTURE FOR REDUCING THERMAL CROSSTALK

COOLING STRUCTURE HAVING METAL PLATING LAYER

PARALLEL MODULE DRIVER

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

IMMERSION-TYPE LIQUID COOLING HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR DEVICE

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SKIVE...

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORT...

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SKIVE...

TWO-PHASE IMMERSION-TYPE COMPOSITE HEAT DISSIPATION DEVICE

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION DEVICE HAVING REINFORCED...

EDMOS AND FABRICATING METHOD OF THE SAME

TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION COMPOSITE STRUCTURE HA...

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING FINS FOR...

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING ACUTE-AN...

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING NON-VERT...

PORTABLE ELECTRONIC DEVICE

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING POROUS S...