Ching-Fang Chu

Person

Hsin-Chu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask transfer method (and related apparatus) for a bumping process
- Patent number 12,132,039
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,087,826
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 11,769,791
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure to prevent metal redeposit and to prevent bond pad c...
- Patent number 11,735,550
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask transfer method (and related apparatus) for a bumping process
- Patent number 11,721,683
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 11,476,337
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask transfer method (and related apparatus) for a bumping process
- Patent number 11,264,368
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure to prevent metal redeposit and to prevent bond pad c...
- Patent number 11,211,352
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 10,790,362
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Salicide formation using a cap layer
- Patent number 9,978,604
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mei-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via structure for noise reduction
- Patent number 9,842,774
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Lin Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing copper contamination in metal-insulator-metal...
- Patent number 9,793,339
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Salicide formation using a cap layer
- Patent number 9,343,318
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to improve performance for metal-insulator-metal (MIM) capa...
- Patent number 9,257,498
- Issue date Feb 9, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS devices having non-uniform stressor doping
- Patent number 9,209,270
- Issue date Dec 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS devices having non-uniform stressor doping
- Patent number 8,994,097
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-device isolation structure
- Patent number 8,026,571
- Issue date Sep 27, 2011
- United Microelectronics Corp.
- Shui-Yen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for avoiding water marks formed during cleaning after well i...
- Patent number 6,479,372
- Issue date Nov 12, 2002
- United Microelectronics Corp.
- Jimmy Liou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MIM DEVICE WITH SELF ALIGNED SPACER
- Publication number 20230369389
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS
- Publication number 20230335543
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20220367646
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-WEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MIM DEVICE WITH SELF ALIGNED SPACER
- Publication number 20220238636
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS
- Publication number 20220181312
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...
- Publication number 20220115349
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...
- Publication number 20210098405
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS
- Publication number 20210066268
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20210020752
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-WEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20190165110
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-WEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SALICIDE FORMATION USING A CAP LAYER
- Publication number 20180261461
- Publication date Sep 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURE FOR NOISE REDUCTION
- Publication number 20170358493
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING COPPER CONTAMINATION IN METAL-INSULATOR-METAL...
- Publication number 20160204190
- Publication date Jul 14, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SALICIDE FORMATION USING A CAP LAYER
- Publication number 20160093497
- Publication date Mar 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to Improve Performance for Metal-Insulator-Metal (MIM) Capa...
- Publication number 20160035817
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS Devices Having Non-Uniform Stressor Doping
- Publication number 20150171189
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS Devices Having Non-Uniform Stressor Doping
- Publication number 20130234217
- Publication date Sep 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SALICIDE FORMATION USING A CAP LAYER
- Publication number 20130200442
- Publication date Aug 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mei-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20090294927
- Publication date Dec 3, 2009
- Shui-Yen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming improved bump structure
- Publication number 20070087544
- Publication date Apr 19, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Liang Chang
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Fang Chu

Person

Patents Grantslast 30 patents

High capacitance MIM device with self aligned spacer

Mask transfer method (and related apparatus) for a bumping process

Method for forming a semiconductor structure

High capacitance MIM device with self aligned spacer

Bump structure to prevent metal redeposit and to prevent bond pad c...

Mask transfer method (and related apparatus) for a bumping process

Method for forming a semiconductor structure

Mask transfer method (and related apparatus) for a bumping process

Bump structure to prevent metal redeposit and to prevent bond pad c...

Semiconductor structure and manufacturing method of the same

Salicide formation using a cap layer

Through substrate via structure for noise reduction

Method for preventing copper contamination in metal-insulator-metal...

Salicide formation using a cap layer

Process to improve performance for metal-insulator-metal (MIM) capa...

MOS devices having non-uniform stressor doping

MOS devices having non-uniform stressor doping

Semiconductor-device isolation structure

Method for avoiding water marks formed during cleaning after well i...

Patents Applicationslast 30 patents

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

HIGH CAPACITANCE MIM DEVICE WITH SELF ALIGNED SPACER

MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

HIGH CAPACITANCE MIM DEVICE WITH SELF ALIGNED SPACER

MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS

BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...

BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...

MASK TRANSFER METHOD (AND RELATED APPARATUS) FOR A BUMPING PROCESS

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SALICIDE FORMATION USING A CAP LAYER

THROUGH SUBSTRATE VIA STRUCTURE FOR NOISE REDUCTION

METHOD FOR PREVENTING COPPER CONTAMINATION IN METAL-INSULATOR-METAL...

SALICIDE FORMATION USING A CAP LAYER

Process to Improve Performance for Metal-Insulator-Metal (MIM) Capa...

MOS Devices Having Non-Uniform Stressor Doping

MOS Devices Having Non-Uniform Stressor Doping

SALICIDE FORMATION USING A CAP LAYER

SEMICONDUCTOR-DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD T...

Method for forming improved bump structure