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Ching-Han Jan
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Chutung, TW
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Patents Grants
last 30 patents
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Patent Grant
Cu seed layer deposition for ULSI metalization
Patent number
6,511,609
Issue date
Jan 28, 2003
Industrial Technology Research Institute
Ching-Han Jan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE
Publication number
20230187144
Publication date
Jun 15, 2023
MEDIATEK INC.
Je-Min WEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED MATCHING CHARACTERISTICS OF POLY...
Publication number
20230038119
Publication date
Feb 9, 2023
MEDIATEK INC.
Cheng-Hua LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20220384608
Publication date
Dec 1, 2022
MEDIATEK INC.
Cheng-Hua LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20220238712
Publication date
Jul 28, 2022
MEDIATEK INC.
Cheng-Hua LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY...
Publication number
20100109053
Publication date
May 6, 2010
Ching-Han Jan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cu seed layer deposition for ULSI metalization
Publication number
20020113038
Publication date
Aug 22, 2002
Ching-Han Jan
H01 - BASIC ELECTRIC ELEMENTS