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Ching-Hsiang Cheng
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Palo Alto, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Capacitive micromachined ultrasonic transducer array with through-s...
Patent number
7,545,075
Issue date
Jun 9, 2009
The Board of Trustees of the Leland Stanford Junior University
Yongli Huang
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information
Patent Grant
Electrical through wafer interconnects
Patent number
6,836,020
Issue date
Dec 28, 2004
The Board of Trustees of the Leland Stanford Junior University
Ching-Hsiang Cheng
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Capacitive micromachined ultrasonic transducer array with through-s...
Publication number
20060075818
Publication date
Apr 13, 2006
Yongli Huang
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information
Patent Application
ELECTRICAL THROUGH WAFER INTERCONNECTS
Publication number
20040141421
Publication date
Jul 22, 2004
Ching-Hsiang Cheng
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL