Ching-Hua Chiang

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Lock assembly for a door of a distribution box
- Patent number 11,959,304
- Issue date Apr 16, 2024
- Asmith Manufacturing Company
- Ching-Hua Chiang
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 10,249,562
- Issue date Apr 2, 2019
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,236,227
- Issue date Mar 19, 2019
- Siliconware Prescision Industries Co., Ltd.
- Lung-Shan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating substrate structure
- Patent number 10,199,345
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Hsin-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electronic package
- Patent number 10,199,320
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 10,096,541
- Issue date Oct 9, 2018
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof and substrate str...
- Patent number 10,049,973
- Issue date Aug 14, 2018
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, fabrication method thereof and conductive stru...
- Patent number 9,899,344
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Hsin-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 9,818,683
- Issue date Nov 14, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, electronic package and method for fabricating...
- Patent number 9,754,868
- Issue date Sep 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,748,183
- Issue date Aug 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,627,307
- Issue date Apr 18, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method of manufacturing the same
- Patent number 9,196,596
- Issue date Nov 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Draw latch having kick-out catch
- Patent number 7,017,955
- Issue date Mar 28, 2006
- Asmith Manufacturing Company
- Ching Hua Chiang
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Latch device for electric wall box
- Patent number 6,794,572
- Issue date Sep 21, 2004
- Ching Hua Chiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Latch assembly adapted to be mounted on a recessed door of a cabine...
- Patent number 6,578,884
- Issue date Jun 17, 2003
- Ching-Hua Chiang
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES

Patents Applicationslast 30 patents

Information Patent Application
Lock Assembly for a Door of a Distribution Box
- Publication number 20240110407
- Publication date Apr 4, 2024
- ASMITH MANUFACTURING COMPANY
- Ching-Hua Chiang
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
METHOD OF FABRICATING SUBSTRATE STRUCTURE
- Publication number 20180138140
- Publication date May 17, 2018
- Siliconware Precision Industries Co., Ltd.
- Hsin-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC PACKAGE
- Publication number 20180040550
- Publication date Feb 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20170330826
- Publication date Nov 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, ELECTRONIC PACKAGE AND METHOD FOR FABRICATING...
- Publication number 20170194238
- Publication date Jul 6, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170186703
- Publication date Jun 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170148716
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170040248
- Publication date Feb 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, FABRICATION METHOD THEREOF AND CONDUCTIVE STRU...
- Publication number 20160358873
- Publication date Dec 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Hsin-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE STR...
- Publication number 20160276256
- Publication date Sep 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package and fabrication method thereof
- Publication number 20160260644
- Publication date Sep 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Lung-Shan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160148873
- Publication date May 26, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160133556
- Publication date May 12, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160086903
- Publication date Mar 24, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160066427
- Publication date Mar 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF
- Publication number 20160049359
- Publication date Feb 18, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140367849
- Publication date Dec 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Latch assembly adapted to be mounted on a recessed door of a cabine...
- Publication number 20020167181
- Publication date Nov 14, 2002
- Ching-Hua Chiang
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES

Ching-Hua Chiang

Person

Patents Grantslast 30 patents

Lock assembly for a door of a distribution box

Package structure and fabrication method thereof

Electronic package and fabrication method thereof

Method of fabricating substrate structure

Method of fabricating electronic package

Method for fabricating electronic package

Electronic package and fabrication method thereof and substrate str...

Substrate structure, fabrication method thereof and conductive stru...

Electronic package and method of fabricating the same

Substrate structure, electronic package and method for fabricating...

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Interposer and method of manufacturing the same

Draw latch having kick-out catch

Latch device for electric wall box

Latch assembly adapted to be mounted on a recessed door of a cabine...

Patents Applicationslast 30 patents

Lock Assembly for a Door of a Distribution Box

METHOD OF FABRICATING SUBSTRATE STRUCTURE

METHOD OF FABRICATING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

SUBSTRATE STRUCTURE, ELECTRONIC PACKAGE AND METHOD FOR FABRICATING...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

SUBSTRATE STRUCTURE, FABRICATION METHOD THEREOF AND CONDUCTIVE STRU...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE STR...

Electronic package and fabrication method thereof

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF

INTERPOSER AND METHOD OF MANUFACTURING THE SAME

Latch assembly adapted to be mounted on a recessed door of a cabine...