Ching-Jen Han

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing opening and via opening
- Patent number 7,648,910
- Issue date Jan 19, 2010
- Winbond Electronics Corp.
- Ching-Jen Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING GATE DIELECTRIC LAYER
- Publication number 20080160768
- Publication date Jul 3, 2008
- WINBOND ELECTRONICS CORP.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OPENING AND VIA OPENING
- Publication number 20080160756
- Publication date Jul 3, 2008
- WINBOND ELECTRONICS CORP.
- Ching-Jen Han
- H01 - BASIC ELECTRIC ELEMENTS