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Ching-Liou HUANG
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San Diego, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Device comprising first solder interconnects aligned in a first dir...
Patent number
11,437,307
Issue date
Sep 6, 2022
QUALCOMM Incorporated
Abdolreza Langari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device comprising first solder interconnects aligned in a first dir...
Patent number
10,916,494
Issue date
Feb 9, 2021
QUALCOMM Incorporated
Abdolreza Langari
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SUPPLEMENTAL METAL LAYER...
Publication number
20230118028
Publication date
Apr 20, 2023
QUALCOMM Incorporated
Michelle Yejin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIR...
Publication number
20210066177
Publication date
Mar 4, 2021
QUALCOMM Incorporated
Abdolreza LANGARI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIR...
Publication number
20200211943
Publication date
Jul 2, 2020
QUALCOMM Incorporated
Abdolreza LANGARI
H01 - BASIC ELECTRIC ELEMENTS