Ching Meng Fang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 11,227,809
- Issue date Jan 18, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 9,627,338
- Issue date Apr 18, 2017
- STATS ChipPAC Pte. Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around overmold for electronic assembly
- Patent number 7,616,448
- Issue date Nov 10, 2009
- Delphi Technologies, Inc.
- Thomas A. Degenkolb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic assembly
- Patent number 7,462,077
- Issue date Dec 9, 2008
- Delphi Technologies, Inc.
- Kin Yean Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic assembly with metal seal ring
- Patent number 7,455,552
- Issue date Nov 25, 2008
- Delphi Technologies, Inc.
- Ching Meng Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making a Fan-Out Semiconductor P...
- Publication number 20240379479
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20220093479
- Publication date Mar 24, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20170186660
- Publication date Jun 29, 2017
- STATS ChipPAC Pte Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20140252641
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlocking overmold for electronic assembly
- Publication number 20090197478
- Publication date Aug 6, 2009
- Larry M. Mandel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wrap-around overmold for electronic assembly
- Publication number 20090073663
- Publication date Mar 19, 2009
- Thomas A. Degenkolb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overmolded electronic assembly
- Publication number 20080124987
- Publication date May 29, 2008
- Kin Yean Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ching Meng Fang

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming ultra high density embed...

Semiconductor device and method of forming ultra high density embed...

Semiconductor device and method of forming ultra high density embed...

Wrap-around overmold for electronic assembly

Overmolded electronic assembly

Overmolded electronic assembly with metal seal ring

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making a Fan-Out Semiconductor P...

Semiconductor Device and Method of Stacking Hybrid Substrates with...

Semiconductor Device and Method of Forming Ultra High Density Embed...

Semiconductor Device and Method of Forming Ultra High Density Embed...

Semiconductor Device and Method of Forming Ultra High Density Embed...

Interlocking overmold for electronic assembly

Wrap-around overmold for electronic assembly

Overmolded electronic assembly