Ching-Pin Yuan

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor device packages having alignment m...
- Patent number 12,020,997
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck, lamination process, and manufacturing method of semiconducto...
- Patent number 11,993,066
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jie Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device package having testing pads...
- Patent number 11,721,598
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device package having dummy devices...
- Patent number 11,309,223
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device package having testing pads...
- Patent number 10,672,674
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 10,347,607
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Pin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 10,147,704
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Pin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structure
- Patent number 9,899,355
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Pin Yuan
- G02 - OPTICS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,875,982
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...
- Publication number 20240198651
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jie Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
- Publication number 20240063048
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...
- Publication number 20240017538
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jie Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20230352352
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307404
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK, LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTO...
- Publication number 20220314595
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jie Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Device Packages
- Publication number 20220238398
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method
- Publication number 20200294870
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method
- Publication number 20200006164
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20190164919
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20190115321
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Pin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170352634
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170338203
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Pin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20170092626
- Publication date Mar 30, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Pin Yuan
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Pin Yuan

Person

Patents Grantslast 30 patents

Methods of forming semiconductor device packages having alignment m...

Chuck, lamination process, and manufacturing method of semiconducto...

Semiconductor device and method of manufacturing

Method of forming semiconductor device package having testing pads...

Semiconductor device and method of manufacturing

Method of forming semiconductor device package having dummy devices...

Semiconductor device and method of manufacturing

Method of forming semiconductor device package having testing pads...

Semiconductor devices and methods of manufacture thereof

Semiconductor devices and methods of manufacturing thereof

Three-dimensional integrated circuit structure

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...

WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...

LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKA...

METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHUCK, LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTO...

Semiconductor Device and Method of Manufacturing

Methods of Forming Semiconductor Device Packages

Semiconductor Device and Method of Manufacturing

Semiconductor Device Package and Method

Semiconductor Device Package and Method

Semiconductor Device and Method of Manufacturing

Semiconductor Devices and Methods of Manufacture Thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Devices and Methods of Manufacture Thereof

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE