Ching-Ping Janet Shen

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate or panel with releasable core
- Patent number 10,398,033
- Issue date Aug 27, 2019
- Intel Corporation
- Ravi Shankar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible microelectronic systems and methods of fabricating the same
- Patent number 10,103,037
- Issue date Oct 16, 2018
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate or panel with releasable core
- Patent number 10,098,233
- Issue date Oct 9, 2018
- Intel Corporation
- Ravi Shankar
- B32 - LAYERED PRODUCTS
Information Patent Grant
Panel with releasable core
- Patent number 9,554,472
- Issue date Jan 24, 2017
- Intel Corporation
- Ching-Ping Janet Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel with releasable core
- Patent number 9,554,468
- Issue date Jan 24, 2017
- Intel Corporation
- Ching-Ping Janet Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate or panel with releasable core
- Patent number 9,522,514
- Issue date Dec 20, 2016
- Intel Corporation
- Ravi Shankar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded architecture using resin coated copper
- Patent number 9,451,696
- Issue date Sep 20, 2016
- Intel Corporation
- Dilan Seneviratne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel with releasable core
- Patent number 9,434,135
- Issue date Sep 6, 2016
- Intel Corporation
- Jean-Marie Erie
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PANEL WITH RELEASABLE CORE
- Publication number 20170202080
- Publication date Jul 13, 2017
- Intel Corporation
- Ching-Ping Janet Shen
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE OR PANEL WITH RELEASABLE CORE
- Publication number 20170181290
- Publication date Jun 22, 2017
- Intel Corporation
- Ravi Shankar
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE OR PANEL WITH RELEASABLE CORE
- Publication number 20170021605
- Publication date Jan 26, 2017
- Intel Corporation
- Ravi Shankar
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME
- Publication number 20150325491
- Publication date Nov 12, 2015
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL WITH RELEASABLE CORE
- Publication number 20150181717
- Publication date Jun 25, 2015
- Ching-Ping Janet Shen
- B32 - LAYERED PRODUCTS
Information Patent Application
PANEL WITH RELEASABLE CORE
- Publication number 20150181713
- Publication date Jun 25, 2015
- Ching-Ping Janet Shen
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE OR PANEL WITH RELEASABLE CORE
- Publication number 20150174858
- Publication date Jun 25, 2015
- Ravi Shankar
- B32 - LAYERED PRODUCTS
Information Patent Application
PANEL WITH RELEASABLE CORE
- Publication number 20150174859
- Publication date Jun 25, 2015
- Intel Corporation
- Jean-Marie Erie
- B32 - LAYERED PRODUCTS
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Ping Janet Shen

Person

Patents Grantslast 30 patents

Substrate or panel with releasable core

Flexible microelectronic systems and methods of fabricating the same

Substrate or panel with releasable core

Panel with releasable core

Panel with releasable core

Substrate or panel with releasable core

Embedded architecture using resin coated copper

Panel with releasable core

Patents Applicationslast 30 patents

PANEL WITH RELEASABLE CORE

SUBSTRATE OR PANEL WITH RELEASABLE CORE

SUBSTRATE OR PANEL WITH RELEASABLE CORE

FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME

PANEL WITH RELEASABLE CORE

PANEL WITH RELEASABLE CORE

SUBSTRATE OR PANEL WITH RELEASABLE CORE

PANEL WITH RELEASABLE CORE

EMBEDDED ARCHITECTURE USING RESIN COATED COPPER