Ching-Po Li

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal capacitor and methods of manufacturing
- Patent number 12,328,886
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 12,230,585
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,184
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation system
- Patent number 12,125,665
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation epitaxial bi-layer for backside deep trench isolation str...
- Patent number 12,074,186
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packing method and electronic device
- Patent number 12,056,618
- Issue date Aug 6, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Ying-Sheng Luo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state image sensor
- Patent number 12,046,609
- Issue date Jul 23, 2024
- VisEra Technologies Company Limited
- Ching-Hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor
- Patent number 12,046,611
- Issue date Jul 23, 2024
- VisEra Technologies Company Limited
- Ching-Hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor
- Patent number 12,048,172
- Issue date Jul 23, 2024
- VisEra Technologies Company Limited
- Ching-Hua Li
Information Patent Grant
Glasses type display device
- Patent number 12,032,165
- Issue date Jul 9, 2024
- HTC Corporation
- Tung-Hsin Yeh
- G02 - OPTICS
Information Patent Grant
Method for forming semiconductor-on-insulator (SOI) substrate by cl...
- Patent number 12,002,813
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage tracking circuits with low power consumption and electronic...
- Patent number 11,940,828
- Issue date Mar 26, 2024
- Vanguard International Semiconductor Corporation
- Shao-Chang Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensing element
- Patent number 11,869,910
- Issue date Jan 9, 2024
- Visera Technologies Company Ltd
- Ching-Hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 11,869,761
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light absorbing layer to enhance P-type diffusion for DTI in image...
- Patent number 11,817,469
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection circuit
- Patent number 11,811,222
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Yeh-Ning Jou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Correcting device and correcting method of real-time image
- Patent number 11,803,975
- Issue date Oct 31, 2023
- ML TECHNOLOGY LTD.
- Ying-Chang Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Internet-of-things wireless power transfer sensor
- Patent number 11,791,658
- Issue date Oct 17, 2023
- Tamkang University
- Ching-Lieh Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Enhanced trench isolation structure
- Patent number 11,784,204
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full well capacity for image sensor
- Patent number 11,721,774
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart hub
- Patent number 11,699,926
- Issue date Jul 11, 2023
- Tamkang University
- Ching-Lieh Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Patterned electrode structure for image sensor
- Patent number 11,699,768
- Issue date Jul 11, 2023
- Visera Technologies Company Ltd
- Kai-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical wafer alignment detection for bonding process
- Patent number 11,688,717
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer isolation structure for high voltage silicon-on-insulato...
- Patent number 11,682,578
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type field effect transistor and method for fabricating the same
- Patent number 11,664,425
- Issue date May 30, 2023
- United Microelectronics Corp.
- Shi-You Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage tracking circuits and electronic circuits
- Patent number 11,652,477
- Issue date May 16, 2023
- Vanguard International Semiconductor Corporation
- Shao-Chang Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solid-state image sensor
- Patent number 11,631,709
- Issue date Apr 18, 2023
- VisEra Technologies Company Limited
- Ching-Hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for testing chip or die with better system IR drop
- Patent number 11,573,264
- Issue date Feb 7, 2023
- Mediatek Inc.
- Ching-Chih Li
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and operation circuit
- Patent number 11,574,997
- Issue date Feb 7, 2023
- Vanguard International Semiconductor Corporation
- Shao-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- Publication number 20250208212
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Ching-Iang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY-ISOLATED MOS DEVICE
- Publication number 20250203957
- Publication date Jun 19, 2025
- United Microelectronics Corp.
- Yu Hsuan Chang
Information Patent Application
AUTOMATIC CHECK METHOD AND DEVICE
- Publication number 20250165670
- Publication date May 22, 2025
- MEDIATEK INC.
- Chee-Kong Ung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20250157943
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR
- Publication number 20250151435
- Publication date May 8, 2025
- VisEra Technologies Company Limited
- Ching-Hua LI
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250142847
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JUI-LIN CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079283
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE
- Publication number 20240395730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20240379692
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION SYSTEM
- Publication number 20240379321
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20240379713
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION EPITAXIAL BI-LAYER FOR BACKSIDE DEEP TRENCH ISOLATION STR...
- Publication number 20240371902
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20240282775
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOCHIP AND METHOD FOR TRACKING POSTOPERATIVE RECURRENCE STATUS OF...
- Publication number 20240241126
- Publication date Jul 18, 2024
- National Taiwan University
- Szu-Hua Pan
- G01 - MEASURING TESTING
Information Patent Application
DRIVING CIRCUIT
- Publication number 20240222965
- Publication date Jul 4, 2024
- Vanguard International Semiconductor Corporation
- Shao-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20240186258
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
IMAGE SENSOR
- Publication number 20240105744
- Publication date Mar 28, 2024
- VisEra Technologies Company Ltd.
- Ching-Hua LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKING METHOD AND ELECTRONIC DEVICE
- Publication number 20240070472
- Publication date Feb 29, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Ying-Sheng LUO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR
- Publication number 20240072082
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE TRACKING CIRCUITS AND ELECTRONIC CIRCUITS
- Publication number 20240061455
- Publication date Feb 22, 2024
- Vanguard International Semiconductor Corporation
- Shao-Chang HUANG
- G05 - CONTROLLING REGULATING
Information Patent Application
TRAPPING LAYER FOR A RADIO FREQUENCY DIE AND METHODS OF FORMATION
- Publication number 20240030222
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED TRENCH ISOLATION STRUCTURE
- Publication number 20240021642
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...
- Publication number 20230411425
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
- Publication number 20230402487
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230387189
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUI-LIN CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME
- Publication number 20230378125
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE STRUCTURE FOR IMAGE SENSOR
- Publication number 20230378217
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CLEANING FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
- Publication number 20230378215
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
- Publication number 20230369367
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Po Li

Person

Patents Grantslast 30 patents

Metal-insulator-metal capacitor and methods of manufacturing

Photolithography alignment process for bonded wafers

Semiconductor structure and method for forming the same

Ion implantation system

Isolation epitaxial bi-layer for backside deep trench isolation str...

Packing method and electronic device

Solid-state image sensor

Solid-state image sensor

Solid-state image sensor

Glasses type display device

Method for forming semiconductor-on-insulator (SOI) substrate by cl...

Voltage tracking circuits with low power consumption and electronic...

Photolithography alignment process for bonded wafers

Light sensing element

Back-side deep trench isolation structure for image sensor

Light absorbing layer to enhance P-type diffusion for DTI in image...

Electrostatic discharge protection circuit

Correcting device and correcting method of real-time image

Internet-of-things wireless power transfer sensor

Enhanced trench isolation structure

Full well capacity for image sensor

Smart hub

Patterned electrode structure for image sensor

Mechanical wafer alignment detection for bonding process

Multilayer isolation structure for high voltage silicon-on-insulato...

P-type field effect transistor and method for fabricating the same

Voltage tracking circuits and electronic circuits

Solid-state image sensor

Device for testing chip or die with better system IR drop

Semiconductor structure and operation circuit

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND OPERATING METHOD THEREOF

FULLY-ISOLATED MOS DEVICE

AUTOMATIC CHECK METHOD AND DEVICE

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

SOLID-STATE IMAGE SENSOR

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

ION IMPLANTATION SYSTEM

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

ISOLATION EPITAXIAL BI-LAYER FOR BACKSIDE DEEP TRENCH ISOLATION STR...

METHOD FOR FORMING SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

BIOCHIP AND METHOD FOR TRACKING POSTOPERATIVE RECURRENCE STATUS OF...

DRIVING CIRCUIT

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

IMAGE SENSOR

PACKING METHOD AND ELECTRONIC DEVICE

PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR

VOLTAGE TRACKING CIRCUITS AND ELECTRONIC CIRCUITS

TRAPPING LAYER FOR A RADIO FREQUENCY DIE AND METHODS OF FORMATION

ENHANCED TRENCH ISOLATION STRUCTURE

LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...

DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME

PHOTODIODE STRUCTURE FOR IMAGE SENSOR

PRE-CLEANING FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR

PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR