Ching-San Lin

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Wufeng Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Die structure and die connecting method
- Patent number 8,518,743
- Issue date Aug 27, 2013
- Raydium Semiconductor Corporation
- Chia-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACT...
- Publication number 20130249086
- Publication date Sep 26, 2013
- Raydium Semiconductor Corporation
- Ching-San Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120018880
- Publication date Jan 26, 2012
- Kun-Tai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WAFER DICING METHOD
- Publication number 20120003817
- Publication date Jan 5, 2012
- Ching-San Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACT...
- Publication number 20110254152
- Publication date Oct 20, 2011
- Ching-San Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURE AND DIE CONNECTING METHOD
- Publication number 20110254153
- Publication date Oct 20, 2011
- Chia-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS