Ching-Shun Huang

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Chigtong Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Structure of dielectric layers in built-up layers of wafer level pa...
- Patent number 7,453,148
- Issue date Nov 18, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-chips package with reduced structure and method for forming t...
- Publication number 20080197469
- Publication date Aug 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF DIELECTRIC LAYERS IN BUILT-UP LAYERS OF WAFER LEVEL PA...
- Publication number 20080150130
- Publication date Jun 26, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20080136004
- Publication date Jun 12, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE WITH BUILD UP LAYERS
- Publication number 20080088004
- Publication date Apr 17, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS