Ching-Sung Yeh

Person

Changhua City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including liner structure
- Patent number 12,027,419
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vertical conductive graphene and met...
- Patent number 11,948,837
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head-mounted eye tracking system
- Patent number 11,803,052
- Issue date Oct 31, 2023
- Industrial Technology Research Institute
- Cheng-Jhih Luo
- G02 - OPTICS
Information Patent Grant
Method of dummy pattern layout
- Patent number 11,545,484
- Issue date Jan 3, 2023
- United Microelectronics Corp.
- Jui-Fa Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 10,964,689
- Issue date Mar 30, 2021
- United Microelectronics Corp.
- Jui-Fa Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,930,552
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Light-emitting device having a patterned substrate and the method t...
- Patent number 10,886,433
- Issue date Jan 5, 2021
- Epistar Corporation
- Ta-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having graphene-capped metal i...
- Patent number 10,651,279
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,453,746
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Light-emitting device having a patterned substrate and the method t...
- Patent number 10,374,125
- Issue date Aug 6, 2019
- Epistar Corporation
- Ta-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having graphene-capped metal i...
- Patent number 10,164,018
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method thereof
- Patent number 10,163,698
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Fu Yeh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrateless light emitting diode (LED) package for size shrinking...
- Patent number 10,134,709
- Issue date Nov 20, 2018
- Industrial Technology Research Institute
- Ming-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device having a patterned substrate and the method t...
- Patent number 10,038,116
- Issue date Jul 31, 2018
- Epistar Corporation
- Ta-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structure for copper interconnect
- Patent number 9,984,975
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 9,966,304
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structure for copper interconnect
- Patent number 9,966,339
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 9,947,583
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and light source
- Patent number 9,897,281
- Issue date Feb 20, 2018
- Young Lighting Technology Inc.
- Chih-Ming Hu
- G02 - OPTICS
Information Patent Grant
Light-emitting device having a patterned substrate and the method t...
- Patent number 9,780,259
- Issue date Oct 3, 2017
- Epistar Corporation
- Ta-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via plating with seed layer
- Patent number 9,640,431
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for back end of line semiconductor device proc...
- Patent number 9,613,854
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum interconnection apparatus
- Patent number 9,607,891
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 9,570,347
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Object detection system
- Patent number 9,483,711
- Issue date Nov 1, 2016
- Altek Autotronics Corporation
- Ching-Sung Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Aluminum interconnection apparatus
- Patent number 9,455,184
- Issue date Sep 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing salicide and a carbon nanotube metal contact
- Patent number 9,391,023
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via plating with seed layer
- Patent number 9,324,608
- Issue date Apr 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,231,151
- Issue date Jan 5, 2016
- Epistar Corporation
- Ta-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for back end of line semiconductor device proc...
- Patent number 9,142,505
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079313
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cian-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20240321632
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20240203789
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240055352
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cian-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL UNCLONABLE FUNCTION GENERATOR AND MANUFACTURING METHOD THE...
- Publication number 20240006345
- Publication date Jan 4, 2024
- United Microelectronics Corp.
- Po Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMI...
- Publication number 20230387239
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...
- Publication number 20230352409
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Pei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PHYSICALLY UNCLONABLE FUNCTION DEVICE
- Publication number 20230260827
- Publication date Aug 17, 2023
- UNITED MICROELECTRONICS CORP.
- Ping-Chia Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230154791
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20230064444
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD-MOUNTED EYE TRACKING SYSTEM
- Publication number 20220206294
- Publication date Jun 30, 2022
- Industrial Technology Research Institute
- Cheng-Jhih Luo
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20210407852
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN METHOD OF DUMMY PATTERN LAYOUT
- Publication number 20210134790
- Publication date May 6, 2021
- United Microelectronics Corp.
- Jui-Fa Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20200051857
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Application
LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD T...
- Publication number 20190319170
- Publication date Oct 17, 2019
- EPISTAR CORPORATION
- Ta-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure Having Graphene-Capped Metal I...
- Publication number 20190131408
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device Having a Patterned Substrate And the Method T...
- Publication number 20190067518
- Publication date Feb 28, 2019
- EPISTAR CORPORATION
- Ta-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND DESIGN METHOD OF DUMMY PATTERN LAYOUT
- Publication number 20190057962
- Publication date Feb 21, 2019
- United Microelectronics Corp.
- Jui-Fa Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING GRAPHENE-CAPPED METAL I...
- Publication number 20180350913
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20180233406
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELL
- Publication number 20180013018
- Publication date Jan 11, 2018
- NEO SOLAR POWER CORP.
- Shan-Chuang PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD T...
- Publication number 20170365740
- Publication date Dec 21, 2017
- EPISTAR CORPORATION
- Ta-Chen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Via Plating with Seed Layer
- Publication number 20170236750
- Publication date Aug 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20170170066
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND LIGHT SOURCE
- Publication number 20170146216
- Publication date May 25, 2017
- YOUNG LIGHTING TECHNOLOGY INC.
- Chih-Ming Hu
- F21 - LIGHTING
Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE
- Publication number 20160379875
- Publication date Dec 29, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Via Plating with Seed Layer
- Publication number 20160240434
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD T...
- Publication number 20160118538
- Publication date Apr 28, 2016
- EPISTAR CORPORATION
- Ta-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Back End of Line Semiconductor Device Proc...
- Publication number 20160005648
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Interconnection Apparatus
- Publication number 20150364370
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Sung Yeh

Person

Patents Grantslast 30 patents

Semiconductor device including liner structure

Semiconductor structure having vertical conductive graphene and met...

Head-mounted eye tracking system

Method of dummy pattern layout

Semiconductor structure

Method of semiconductor integrated circuit fabrication

Light-emitting device having a patterned substrate and the method t...

Semiconductor interconnect structure having graphene-capped metal i...

Method of semiconductor integrated circuit fabrication

Light-emitting device having a patterned substrate and the method t...

Semiconductor interconnect structure having graphene-capped metal i...

Interconnect structure and manufacturing method thereof

Substrateless light emitting diode (LED) package for size shrinking...

Light-emitting device having a patterned substrate and the method t...

Barrier structure for copper interconnect

Method for forming interconnect structure

Barrier structure for copper interconnect

Method of semiconductor integrated circuit fabrication

Optical module and light source

Light-emitting device having a patterned substrate and the method t...

Method for via plating with seed layer

Method and apparatus for back end of line semiconductor device proc...

Aluminum interconnection apparatus

Method of semiconductor integrated circuit fabrication

Object detection system

Aluminum interconnection apparatus

Method for producing salicide and a carbon nanotube metal contact

Method for via plating with seed layer

Light-emitting device

Method and apparatus for back end of line semiconductor device proc...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

PHYSICAL UNCLONABLE FUNCTION GENERATOR AND MANUFACTURING METHOD THE...

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMI...

INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...

METHOD FOR FABRICATING PHYSICALLY UNCLONABLE FUNCTION DEVICE

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

HEAD-MOUNTED EYE TRACKING SYSTEM

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

DESIGN METHOD OF DUMMY PATTERN LAYOUT

Method of Semiconductor Integrated Circuit Fabrication

LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD T...

Semiconductor Interconnect Structure Having Graphene-Capped Metal I...

Light-Emitting Device Having a Patterned Substrate And the Method T...

SEMICONDUCTOR STRUCTURE AND DESIGN METHOD OF DUMMY PATTERN LAYOUT

SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING GRAPHENE-CAPPED METAL I...

Method of Semiconductor Integrated Circuit Fabrication

SOLAR CELL

LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD T...

Method for Via Plating with Seed Layer

Method of Semiconductor Integrated Circuit Fabrication

OPTICAL MODULE AND LIGHT SOURCE

METHOD FOR FORMING INTERCONNECT STRUCTURE

Method for Via Plating with Seed Layer

LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD T...

Method and Apparatus for Back End of Line Semiconductor Device Proc...

Aluminum Interconnection Apparatus