Ching Ting PENG

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Taoyuan City, TW

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Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230081775
- Publication date Mar 16, 2023
- XINTEC INC.
- Hsin-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS