Ching-Wen Hsaio

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Banciao City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electrically stackable semiconductor wafer and chip packages
- Patent number 9,601,474
- Issue date Mar 21, 2017
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer leveled chip packaging structure and method thereof
- Patent number 9,059,181
- Issue date Jun 16, 2015
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer Leveled Chip Packaging Structure and Method Thereof
- Publication number 20150364457
- Publication date Dec 17, 2015
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Leveled Chip Packaging Structure and Method Thereof
- Publication number 20140217587
- Publication date Aug 7, 2014
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS