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MULTI-LAYER TRENCH CAPACITOR STRUCTURE
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Publication number 20240153987
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Publication date May 9, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsuan-Han Tseng
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE CONTACT IN WAFER BACKSIDE
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Publication number 20240145498
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Publication date May 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hao-Lin Yang
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H01 - BASIC ELECTRIC ELEMENTS
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CRUCIFORM BONDING STRUCTURE FOR 3D-IC
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Publication number 20240128216
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Publication date Apr 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hao-Lin Yang
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H01 - BASIC ELECTRIC ELEMENTS
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WASTE COLLECTION APPARATUS
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Publication number 20240084536
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Publication date Mar 14, 2024
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EVOLUTIVE LABS CO., LTD.
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Wei-Chun LIU
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E02 - HYDRAULIC ENGINEERING FOUNDATIONS SOIL SHIFTING
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3D SENSING SYSTEM AND METHOD
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Publication number 20240037767
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Publication date Feb 1, 2024
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HIMAX TECHNOLOGIES LIMITED
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Min-Chian Wu
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G06 - COMPUTING CALCULATING COUNTING
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ACCESSORY FOR HANDHELD DEVICE
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Publication number 20240011597
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Publication date Jan 11, 2024
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EVOLUTIVE LABS CO., LTD.
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CHING-FU WANG
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A45 - HAND OR TRAVELLING ARTICLES
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HYBRID BOND PAD STRUCTURE
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Publication number 20230361085
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Publication date Nov 9, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Sin-Yao Huang
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H01 - BASIC ELECTRIC ELEMENTS
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3D SENSING SYSTEM
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Publication number 20230333251
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Publication date Oct 19, 2023
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HIMAX TECHNOLOGIES LIMITED
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Min-Chian Wu
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G01 - MEASURING TESTING
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