Ching-Yang Wen

Person

SINGAPORE, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,881,529
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240234350
- Publication date Jul 11, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING ANTENNA RULE FOR RADIO-FREQUENCY DEVICE
- Publication number 20240178137
- Publication date May 30, 2024
- UNITED MICROELECTRONICS CORP.
- XINGXING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240170490
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240136312
- Publication date Apr 25, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
- Publication number 20240047266
- Publication date Feb 8, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038832
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING
- Publication number 20230268246
- Publication date Aug 24, 2023
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...
- Publication number 20230071686
- Publication date Mar 9, 2023
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220416081
- Publication date Dec 29, 2022
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDATION PROCESS
- Publication number 20080200039
- Publication date Aug 21, 2008
- United Microelectronics Corp.
- Wenshen Li
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Yang Wen

Person

Patents Grantslast 30 patents

Semiconductor structure and method of wafer bonding

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD FOR DETERMINING ANTENNA RULE FOR RADIO-FREQUENCY DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING

PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

NITRIDATION PROCESS