Ching-Yang Wen

Person

Pingtung County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating an air gap
- Patent number 12,191,195
- Issue date Jan 7, 2025
- United Microelectronics Corp.
- Bo Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,929,213
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,923,373
- Issue date Mar 5, 2024
- United Microelectronics Corp.
- Bo Tao
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of radiofrequency device including mold compou...
- Patent number 11,715,709
- Issue date Aug 1, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 11,670,567
- Issue date Jun 6, 2023
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,476,363
- Issue date Oct 18, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,398,548
- Issue date Jul 26, 2022
- United Microelectronics Corp.
- Wen-Shen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiofrequency device and manufacturing method thereof
- Patent number 11,362,048
- Issue date Jun 14, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,296,023
- Issue date Apr 5, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,923,599
- Issue date Feb 16, 2021
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,903,314
- Issue date Jan 26, 2021
- United Microelectronics Corp.
- Wen-Shen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including buried insulation layer and manufact...
- Patent number 10,763,170
- Issue date Sep 1, 2020
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230082878
- Publication date Mar 16, 2023
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING AN AIR GAP
- Publication number 20230058468
- Publication date Feb 23, 2023
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF RADIOFREQUENCY DEVICE
- Publication number 20220230975
- Publication date Jul 21, 2022
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING
- Publication number 20220013430
- Publication date Jan 13, 2022
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...
- Publication number 20210313116
- Publication date Oct 7, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210125921
- Publication date Apr 29, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210104602
- Publication date Apr 8, 2021
- United Microelectronics Corp.
- Wen-Shen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210098624
- Publication date Apr 1, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200328311
- Publication date Oct 15, 2020
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIOFREQUENCY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200075514
- Publication date Mar 5, 2020
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190355812
- Publication date Nov 21, 2019
- United Microelectronics Corp.
- Wen-Shen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190252253
- Publication date Aug 15, 2019
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20190051666
- Publication date Feb 14, 2019
- UNITED MICROELECTRONICS CORP.
- Wen-Shen Li
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Yang Wen

Person

Patents Grantslast 30 patents

Method of fabricating an air gap

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor structure

Manufacturing method of radiofrequency device including mold compou...

Semiconductor structure and method of wafer bonding

Semiconductor device and method of fabricating the same

Semiconductor device

Radiofrequency device and manufacturing method thereof

Semiconductor device and method of fabricating the same

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device including buried insulation layer and manufact...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

METHOD OF FABRICATING AN AIR GAP

MANUFACTURING METHOD OF RADIOFREQUENCY DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF WAFER BONDING

PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

RADIOFREQUENCY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF