Ching-Yi Hu

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 12,092,839
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 12,054,382
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,782,284
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer bonding alignment
- Patent number 11,742,320
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,726,342
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 11,655,138
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,454,820
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,448,891
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 11,305,980
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Data storage device with a lighting module and control method for t...
- Patent number 11,003,390
- Issue date May 11, 2021
- Silicon Motion, Inc.
- Ching-Hsin Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 10,513,432
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 10,155,656
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective nitride outgassing process for MEMS cavity pressure control
- Patent number 9,884,758
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of affixing a heat sink to a substrate and package thereof
- Patent number 6,677,185
- Issue date Jan 13, 2004
- Orient Semiconductor Electronics Limited
- Hung Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20240361609
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20230400699
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20230359056
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING ALIGNMENT
- Publication number 20230352445
- Publication date Nov 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
- Publication number 20230264945
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20220382069
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20220373815
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G02 - OPTICS
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER BONDING ALIGNMENT
- Publication number 20220293557
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20220242724
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co.,Ltd
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
- Publication number 20220135397
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MUTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20210116713
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20210116714
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DATA STORAGE DEVICE WITH A LIGHTING MODULE AND CONTROL METHOD FOR T...
- Publication number 20200201572
- Publication date Jun 25, 2020
- SILICON MOTION, INC.
- Ching-Hsin HU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20200123003
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20190031503
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20180370790
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL
- Publication number 20170203962
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20170107097
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of affixing a heat sink to a substrate and package thereof
- Publication number 20030100147
- Publication date May 29, 2003
- Hung Chin
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Yi Hu

Person

Patents Grantslast 30 patents

Anti-stiction process for MEMS device

Multifunctional collimator for contact image sensors

Roughness selectivity for MEMS movement stiction reduction

Multifunctional collimator for contact image sensors

Wafer bonding alignment

Multifunctional collimator for contact image sensors

Roughness selectivity for MEMS movement stiction reduction

Multifunctional collimator for contact image sensors

Multifunctional collimator for contact image sensors

Inter-poly connection for parasitic capacitor and die size improvement

Anti-stiction process for MEMS device

Data storage device with a lighting module and control method for t...

Anti-stiction process for MEMS device

Inter-poly connection for parasitic capacitor and die size improvement

Selective nitride outgassing process for MEMS cavity pressure control

Method of affixing a heat sink to a substrate and package thereof

Patents Applicationslast 30 patents

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

WAFER BONDING ALIGNMENT

ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

WAFER BONDING ALIGNMENT

ANTI-STICTION PROCESS FOR MEMS DEVICE

ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION

MUTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

DATA STORAGE DEVICE WITH A LIGHTING MODULE AND CONTROL METHOD FOR T...

ANTI-STICTION PROCESS FOR MEMS DEVICE

ANTI-STICTION PROCESS FOR MEMS DEVICE

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

Method of affixing a heat sink to a substrate and package thereof