Chiou-Shian Peng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,816,169
- Issue date Oct 19, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,485,906
- Issue date Feb 3, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,183,598
- Issue date Feb 27, 2007
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dual-layer polyimide processing on bumping technology
- Patent number 6,958,546
- Issue date Oct 25, 2005
- Taiwan Semiconductor Manufacturing Company
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process to increase bump height and to create a more robust...
- Patent number 6,956,292
- Issue date Oct 18, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form very a fine pitch solder bump using methods of elect...
- Patent number 6,936,923
- Issue date Aug 30, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 6,876,049
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Co.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making tall flip chip bumps
- Patent number 6,756,184
- Issue date Jun 29, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chiou-Shian Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Twin current bipolar device with hi-lo base profile
- Patent number 6,747,336
- Issue date Jun 8, 2004
- Taiwan Semiconductor Manufacturing Company
- Jun-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer photoresist method for fabricating a mushroom bumping pl...
- Patent number 6,649,507
- Issue date Nov 18, 2003
- Taiwan Semiconductor Manufacturing Company
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a color image sensor cell while protecting the bondi...
- Patent number 6,632,700
- Issue date Oct 14, 2003
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process to increase bump height and to create a more robust...
- Patent number 6,605,524
- Issue date Aug 12, 2003
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dual-layer polyimide processing on bumping technology
- Patent number 6,586,323
- Issue date Jul 1, 2003
- Taiwan Semiconductor Manufacturing Company
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bump on a copper pad
- Patent number 6,583,039
- Issue date Jun 24, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 6,482,669
- Issue date Nov 19, 2002
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bumping and backlapping a semiconductor wafer
- Patent number 6,426,283
- Issue date Jul 30, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form bump in bumping technology
- Patent number 6,426,281
- Issue date Jul 30, 2002
- Taiwan Semiconductor Manufacturing Company
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for under bump metal patterning of bumping process
- Patent number 6,372,545
- Issue date Apr 16, 2002
- Taiwan Semiconductor Manufacturing Company
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing solder bodies from a semiconductor wafer
- Patent number 6,319,846
- Issue date Nov 20, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Twin current bipolar device with hi-lo base profile
- Patent number 6,211,028
- Issue date Apr 3, 2001
- Taiwan Semiconductor Manufacturing Company
- Jun-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS
- Publication number 20090111208
- Publication date Apr 30, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Yang-Tung FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Colors only process to reduce package yield loss
- Publication number 20070120155
- Publication date May 31, 2007
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process to increase bump height and to create a more robust...
- Publication number 20040005771
- Publication date Jan 8, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method for dual-layer polyimide processing on bumping technology
- Publication number 20030199159
- Publication date Oct 23, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Colors only process to reduce package yield loss
- Publication number 20030124763
- Publication date Jul 3, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making tall flip chip bumps
- Publication number 20030073036
- Publication date Apr 17, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chiou-Shian Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A BUMP ON A COPPER PAD
- Publication number 20030073300
- Publication date Apr 17, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form bump in bumping technology
- Publication number 20020127836
- Publication date Sep 12, 2002
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUMPING AND BACKLAPPING A SEMICONDUCTOR WAFER
- Publication number 20020068425
- Publication date Jun 6, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Twin current bipolar device with hi-lo base profile
- Publication number 20010010963
- Publication date Aug 2, 2001
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Jun-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Chiou-Shian Peng

Person

Patents Grantslast 30 patents

Colors only process to reduce package yield loss

Colors only process to reduce package yield loss

Colors only process to reduce package yield loss

Method for dual-layer polyimide processing on bumping technology

Bumping process to increase bump height and to create a more robust...

Method to form very a fine pitch solder bump using methods of elect...

Colors only process to reduce package yield loss

Method of making tall flip chip bumps

Twin current bipolar device with hi-lo base profile

Dual layer photoresist method for fabricating a mushroom bumping pl...

Method to form a color image sensor cell while protecting the bondi...

Bumping process to increase bump height and to create a more robust...

Method for dual-layer polyimide processing on bumping technology

Method of forming a bump on a copper pad

Colors only process to reduce package yield loss

Method for bumping and backlapping a semiconductor wafer

Method to form bump in bumping technology

Method for under bump metal patterning of bumping process

Method for removing solder bodies from a semiconductor wafer

Twin current bipolar device with hi-lo base profile

Patents Applicationslast 30 patents

COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS

Colors only process to reduce package yield loss

Bumping process to increase bump height and to create a more robust...

Novel method for dual-layer polyimide processing on bumping technology

Colors only process to reduce package yield loss

Method of making tall flip chip bumps

METHOD OF FORMING A BUMP ON A COPPER PAD

Method to form bump in bumping technology

METHOD FOR BUMPING AND BACKLAPPING A SEMICONDUCTOR WAFER

Twin current bipolar device with hi-lo base profile