Chirayarikathu Veedu Sankarapillai Premachandran

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Wafer Level Package and a Method of Forming a Wafer Level Package
- Publication number 20130020713
- Publication date Jan 24, 2013
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY