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Chirayarikathuveedu Premachandran Sankarapillai
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming through-wafer interconnects for vertical wafer le...
Patent number
7,381,629
Issue date
Jun 3, 2008
Agency for Science, Technology and Research
Chirayarikathuveedu Premachandran Sankarapillai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of stacking thin substrates by transfer bonding
Patent number
7,326,629
Issue date
Feb 5, 2008
Agency for Science, Technology and Research
Ranganathan Nagarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming through-wafer interconnects for vertical wafer le...
Patent number
7,183,176
Issue date
Feb 27, 2007
Agency for Science, Technology and Research
Chirayarikathuveedu Premachandran Sankarapillai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of forming through-wafer interconnects for vertical wafer le...
Publication number
20070141804
Publication date
Jun 21, 2007
Chirayarikathuveedu Premachandran Sankarapillai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of stacking thin substrates by transfer bonding
Publication number
20060057836
Publication date
Mar 16, 2006
Agency For Science, Technology and Research
Ranganathan Nagarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming through-wafer interconnects for vertical wafer le...
Publication number
20060046432
Publication date
Mar 2, 2006
Agency For Science, Technology and Research
Chirayarikathuveedu Premachandran Sankarapillai
H01 - BASIC ELECTRIC ELEMENTS