Chirstopher John Berry

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming back side layers for thinned wafers
- Patent number 7,871,899
- Issue date Jan 18, 2011
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming Back Side Layers For Thinned Wafers and Related...
- Publication number 20110079901
- Publication date Apr 7, 2011
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS