Chisaki Takubo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Acceleration sensor, geophone, and seismic prospecting system
- Patent number 10,989,733
- Issue date Apr 27, 2021
- Hitachi, Ltd.
- Yuudai Kamada
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor
- Patent number 10,935,566
- Issue date Mar 2, 2021
- Hitachi, Ltd.
- Yuudai Kamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 10,802,040
- Issue date Oct 13, 2020
- Hitachi, Ltd.
- Atsushi Isobe
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor
- Patent number 10,802,041
- Issue date Oct 13, 2020
- Hitachi, Ltd.
- Atsushi Isobe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 10,739,376
- Issue date Aug 11, 2020
- Hitachi, Ltd.
- Atsushi Isobe
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor including improved mass body
- Patent number 10,697,995
- Issue date Jun 30, 2020
- Hitachi, Ltd.
- Atsushi Isobe
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor
- Patent number 10,527,642
- Issue date Jan 7, 2020
- Hitachi, Ltd.
- Atsushi Isobe
- G01 - MEASURING TESTING
Information Patent Grant
Inertia sensor with improved detection sensitivity using servo volt...
- Patent number 10,527,643
- Issue date Jan 7, 2020
- Hitachi, Ltd.
- Atsushi Isobe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertia sensor and method of manufacturing the same
- Patent number 10,502,758
- Issue date Dec 10, 2019
- Hitachi, Ltd.
- Takashi Shiota
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity detecting sensor
- Patent number 9,511,993
- Issue date Dec 6, 2016
- Hitachi Automotive Systems, Ltd.
- Kiyoko Yamanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing MEMS device
- Patent number 8,643,927
- Issue date Feb 4, 2014
- Hitachi, Ltd.
- Chisaki Takubo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor HBT MMIC device and semiconductor module
- Patent number 7,547,929
- Issue date Jun 16, 2009
- Renesas Technology Corp.
- Kenichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having led out conductor layers, manufacturing...
- Patent number 7,067,857
- Issue date Jun 27, 2006
- Hitachi, Ltd.
- Kazuhiro Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CDMA communication RF signal processing apparatus using SAW
- Patent number 6,047,306
- Issue date Apr 4, 2000
- Hitachi, Ltd.
- Mitsutaka Hikita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surface acoustic wave equipment
- Patent number 5,814,917
- Issue date Sep 29, 1998
- Hitachi Media Electronics Co., Ltd.
- Atsushi Isobe
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
FUEL BATTERY CELL AND FUEL BATTERY MODULE
- Publication number 20220069327
- Publication date Mar 3, 2022
- HITACHI HIGH-TECH CORPORATION
- Yoshitaka SASAGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCELERATION SENSOR
- Publication number 20190162752
- Publication date May 30, 2019
- Hitachi, Ltd
- Atsushi ISOBE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20180372774
- Publication date Dec 27, 2018
- Hitachi, Ltd
- Atsushi ISOBE
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE
- Publication number 20180346321
- Publication date Dec 6, 2018
- Hitachi, Ltd
- Chisaki TAKUBO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR, GEOPHONE, AND SEISMIC PROSPECTING SYSTEM
- Publication number 20180321274
- Publication date Nov 8, 2018
- Hitachi, Ltd
- Yuudai KAMADA
- G01 - MEASURING TESTING
Information Patent Application
Acceleration Sensor
- Publication number 20180252745
- Publication date Sep 6, 2018
- Hitachi, Ltd
- Atsushi ISOBE
- G01 - MEASURING TESTING
Information Patent Application
ACCELERATION SENSOR
- Publication number 20180252744
- Publication date Sep 6, 2018
- Hitachi, Ltd
- Yuudai KAMADA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIA SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180238926
- Publication date Aug 23, 2018
- Hitachi, Ltd
- Takashi SHIOTA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Acceleration Sensor
- Publication number 20180238929
- Publication date Aug 23, 2018
- Hitachi, Ltd
- Atsushi Isobe
- G01 - MEASURING TESTING
Information Patent Application
Inertia Sensor
- Publication number 20180210005
- Publication date Jul 26, 2018
- Hitachi, Ltd
- Atsushi ISOBE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20170292970
- Publication date Oct 12, 2017
- Hitachi, Ltd
- Atsushi ISOBE
- G01 - MEASURING TESTING
Information Patent Application
THERMOELECTRIC CONVERSION DEVICE
- Publication number 20150221845
- Publication date Aug 6, 2015
- Chisaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Physical Quantity Detecting Sensor
- Publication number 20130346015
- Publication date Dec 26, 2013
- Hitachi Automotive Systems, Ltd.
- Kiyoko Yamanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE
- Publication number 20120038963
- Publication date Feb 16, 2012
- Hitachi, Ltd.
- Chisaki TAKUBO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device having a hole or a step of normal mesa shape a...
- Publication number 20070073448
- Publication date Mar 29, 2007
- RENESAS TECHNOLOGY CORP.
- Chisaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a manufacturing method thereof, and semico...
- Publication number 20060081879
- Publication date Apr 20, 2006
- Kenichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20050040497
- Publication date Feb 24, 2005
- Chisaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method of the same and semicond...
- Publication number 20040212034
- Publication date Oct 28, 2004
- Kazuhiro Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS

Chisaki Takubo

Person

Patents Grantslast 30 patents

Acceleration sensor, geophone, and seismic prospecting system

Acceleration sensor

Acceleration sensor

Acceleration sensor

Acceleration sensor

Acceleration sensor including improved mass body

Acceleration sensor

Inertia sensor with improved detection sensitivity using servo volt...

Inertia sensor and method of manufacturing the same

Semiconductor physical quantity detecting sensor

MEMS device and method of manufacturing MEMS device

Semiconductor HBT MMIC device and semiconductor module

Semiconductor device having led out conductor layers, manufacturing...

CDMA communication RF signal processing apparatus using SAW

Surface acoustic wave equipment

Patents Applicationslast 30 patents

FUEL BATTERY CELL AND FUEL BATTERY MODULE

ACCELERATION SENSOR

ACCELERATION SENSOR

MEMS DEVICE

ACCELERATION SENSOR, GEOPHONE, AND SEISMIC PROSPECTING SYSTEM

Acceleration Sensor

ACCELERATION SENSOR

INERTIA SENSOR AND METHOD OF MANUFACTURING THE SAME

Acceleration Sensor

Inertia Sensor

ACCELERATION SENSOR

THERMOELECTRIC CONVERSION DEVICE

Semiconductor Physical Quantity Detecting Sensor

MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE

Semiconductor device having a hole or a step of normal mesa shape a...

Semiconductor device and a manufacturing method thereof, and semico...

Semiconductor device and manufacturing method of the same

Semiconductor device, manufacturing method of the same and semicond...