Chita Chuang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 11,244,940
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,867,810
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,861,811
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,748,785
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless charging devices having wireless charging coils and method...
- Patent number 10,720,788
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stress reduction apparatus and method
- Patent number 10,692,848
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump on pad (BOP) bonding structure in semiconductor packaged device
- Patent number 10,515,917
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging assembly and method of making the same
- Patent number 10,483,225
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 10,388,620
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,290,600
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump on pad (BOP) bonding structure in semiconductor packaged device
- Patent number 10,163,839
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures in semiconductor device and packaging assembly
- Patent number 9,905,524
- Issue date Feb 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing architecture for integrated circuits
- Patent number 9,881,885
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bump structures in package structure
- Patent number 9,786,621
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bump on pad (BOP) bonding structure in a semico...
- Patent number 9,748,188
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,741,589
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,711,477
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure
- Patent number 9,673,125
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 9,646,943
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 9,472,521
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 9,406,629
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240105654
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless Charging Devices Having Wireless Charging Coils and Method...
- Publication number 20200350782
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200321326
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE ASSEMBLY INCLUDING THE SAME
- Publication number 20200098712
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20200013710
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200006311
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190371718
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HUA-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20190279953
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump on Pad (BOP) Bonding Structure in Semiconductor Packaged Device
- Publication number 20190123008
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ASSEMBLY AND METHOD OF MAKING THE SAME
- Publication number 20180182724
- Publication date Jun 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structures in Package Structure
- Publication number 20180047690
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20170345677
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ON PAD (BOP) BONDING STRUCTURE IN SEMICONDUCTOR PACKAGED DEVICE
- Publication number 20170345783
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20170309588
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20170271291
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Structure and Method of Forming Same
- Publication number 20170243846
- Publication date Aug 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless Charging Devices, Methods of Manufacture Thereof, and Char...
- Publication number 20170104356
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20160336298
- Publication date Nov 17, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- HUA-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20160329293
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20160181220
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20160155733
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160111384
- Publication date Apr 21, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- HUA-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing Architecture for Integrated Circuits
- Publication number 20160079192
- Publication date Mar 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160064340
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- HUA-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump on Pad (BOP) Bonding Structure
- Publication number 20160064347
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elongated Bump Structures in Package Structure
- Publication number 20160027752
- Publication date Jan 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20150371964
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20150318188
- Publication date Nov 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Chita Chuang

Person

Patents Grantslast 30 patents

Stress reduction apparatus and method

Semiconductor device and package assembly including the same

Connector structure and method of forming same

Stress reduction apparatus and method

Bonded structures for package and substrate

Substrate pad structure

Connector structure and method of forming same

Elongated bump structures in package structure

Substrate pad structure

Dummy flip chip bumps for reducing stress

Wireless charging devices having wireless charging coils and method...

Stress reduction apparatus and method

Bump on pad (BOP) bonding structure in semiconductor packaged device

Packaging assembly and method of making the same

Bonded structures for package and substrate

Connector structure and method of forming same

Dummy flip chip bumps for reducing stress

Bump on pad (BOP) bonding structure in semiconductor packaged device

Method for manufacturing semiconductor package structure

Bump structures in semiconductor device and packaging assembly

Metal routing architecture for integrated circuits

Elongated bump structures in package structure

Method of forming a bump on pad (BOP) bonding structure in a semico...

Substrate pad structure

Dummy flip chip bumps for reducing stress

Bonded structures for package and substrate

Interconnection structure

Connector structure and method of forming same

Scheme for connector site spacing and resulting structures

Semiconductor package structure and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Wireless Charging Devices Having Wireless Charging Coils and Method...

Stress Reduction Apparatus and Method

Bonded Structures for Package and Substrate

SEMICONDUCTOR DEVICE AND PACKAGE ASSEMBLY INCLUDING THE SAME

Substrate Pad Structure

Stress Reduction Apparatus and Method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Connector Structure and Method of Forming Same

Dummy Flip Chip Bumps for Reducing Stress

Bump on Pad (BOP) Bonding Structure in Semiconductor Packaged Device

PACKAGING ASSEMBLY AND METHOD OF MAKING THE SAME

Elongated Bump Structures in Package Structure

Substrate Pad Structure

BUMP ON PAD (BOP) BONDING STRUCTURE IN SEMICONDUCTOR PACKAGED DEVICE

Dummy Flip Chip Bumps for Reducing Stress

Bonded Structures for Package and Substrate

Connector Structure and Method of Forming Same

Wireless Charging Devices, Methods of Manufacture Thereof, and Char...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

Bonded Structures for Package and Substrate

Dummy Flip Chip Bumps for Reducing Stress

Stress Reduction Apparatus and Method

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Metal Routing Architecture for Integrated Circuits

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Bump on Pad (BOP) Bonding Structure

Elongated Bump Structures in Package Structure

Bonded Structures for Package and Substrate

Substrate Pad Structure