Chittranjan Mohan GUPTA

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,941,228
- Issue date Apr 10, 2018
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,666,553
- Issue date May 30, 2017
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD
- Publication number 20240178155
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...
- Publication number 20240178154
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
- Publication number 20240120297
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUMP-FUSING AND TAILORED PCB SYSTEM FOR LOOP INDUCTANCE REDUCTION
- Publication number 20240047316
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR SEMICONDUCTOR DEVICES
- Publication number 20230317581
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20230101847
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTILAYER PACKAGE SUBSTRATE
- Publication number 20230021179
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20180301428
- Publication date Oct 18, 2018
- Rajen Manicon Murugan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20170229408
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20150364816
- Publication date Dec 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS

Chittranjan Mohan GUPTA

Person

Patents Grantslast 30 patents

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Patents Applicationslast 30 patents

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...

MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...

JUMP-FUSING AND TAILORED PCB SYSTEM FOR LOOP INDUCTANCE REDUCTION

FLIP CHIP PACKAGE FOR SEMICONDUCTOR DEVICES

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

SEMICONDUCTOR DEVICE WITH A MULTILAYER PACKAGE SUBSTRATE

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...